Polysilicon fatigue test-bed monitoring based on the 2nd harmonic of the device current measurement (Contributo in atti di convegno)

Type
Label
  • Polysilicon fatigue test-bed monitoring based on the 2nd harmonic of the device current measurement (Contributo in atti di convegno) (literal)
Anno
  • 2005-01-01T00:00:00+01:00 (literal)
Http://www.cnr.it/ontology/cnr/pubblicazioni.owl#doi
  • 10.1109/ICMENS.2005.99 (literal)
Alternative label
  • Ferraris E., Fassi I., De Masi B., Del Sarto M. (2005)
    Polysilicon fatigue test-bed monitoring based on the 2nd harmonic of the device current measurement
    in International Conference on MEMS, NANO and Smart Systems, ICMENS 2005, Banff, Alberta (Canada), Luglio 2005
    (literal)
Http://www.cnr.it/ontology/cnr/pubblicazioni.owl#autori
  • Ferraris E., Fassi I., De Masi B., Del Sarto M. (literal)
Pagina inizio
  • 55 (literal)
Pagina fine
  • 60 (literal)
Note
  • Scopus (literal)
  • ISI Web of Science (WOS) (literal)
  • Google Scholar (literal)
Http://www.cnr.it/ontology/cnr/pubblicazioni.owl#affiliazioni
  • CNR, ST MIcroelectronics (literal)
Titolo
  • Polysilicon fatigue test-bed monitoring based on the 2nd harmonic of the device current measurement (literal)
Http://www.cnr.it/ontology/cnr/pubblicazioni.owl#isbn
  • 0769523986 (literal)
Http://www.cnr.it/ontology/cnr/pubblicazioni.owl#curatoriVolume
  • Badawy, W; Moussa, W (literal)
Abstract
  • As the micro technology field expands, the need of simple and standardized methodologies enabling to precisely evaluate device functionality and realibility increases. In particular, under operating conditions, polysilicon devices e.g. accelerometers, gyroscopes and torsional micromirrors are stressed by cyclic mechanical loading. Consequently, the characterization of long-term durability of polysilicon components becomes of primary importance to guarantee MEMS reliable functioning during the whole life. In this paper, the experimental set-up of a polysilicon fatigue test bed based on the 2 nd harmonic of the device current is proposed. The method focuses on the fact that the electrical output signal of electrostatically actuated microdevices is proportional to the driving velocity; thus an indirect system displacement monitoring is achievable and the sample breaking can be registered by electrical measurements. The technique takes advantage of on-chip test design combined whit electrostatic actuation and provides with the development of inexpensive and stable test-systems. © 2005 IEEE. (literal)
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