Integrating a thermo-mechanical solver into the djoser analytical thermal simulator for multilayer power electronic assemblies. Preliminary result (Contributo in atti di convegno)

Type

• Prodotto della ricerca (Classe)
• Contributo in atti di convegno (Classe)

Label

• Integrating a thermo-mechanical solver into the djoser analytical thermal simulator for multilayer power electronic assemblies. Preliminary result (Contributo in atti di convegno) (literal)

Anno

• 2008-01-01T00:00:00+01:00 (literal)

Http://www.cnr.it/ontology/cnr/pubblicazioni.owl#doi

• 10.1109/THETA.2008.5167180 (literal)

Alternative label

• Bagnoli P. E.; Padovani C.; Pagni A.; Pasquinelli G. (2008)
  Integrating a thermo-mechanical solver into the djoser analytical thermal simulator for multilayer power electronic assemblies. Preliminary result
  in SECOND INTERNATIONAL CONFERENCE ON THERMAL ISSUES IN EMERGING TECHNOLOGIES - THEORY AND APPLICATION (THETA), Cairo, Egypt, 17-20 December 2008
  (literal)

Http://www.cnr.it/ontology/cnr/pubblicazioni.owl#autori

• Bagnoli P. E.; Padovani C.; Pagni A.; Pasquinelli G. (literal)

Pagina inizio

• 303 (literal)

Pagina fine

• 310 (literal)

Http://www.cnr.it/ontology/cnr/pubblicazioni.owl#url

• http://ieeexplore.ieee.org/xpl/articleDetails.jsp?tp=&arnumber=5167180&contentType=Conference+Publications&searchField%3DSearch_All%26queryText%3DIntegrating+a+thermo-mechanical+solver+into+the+djoser+analytical+thermal+simulator+for+multilayer+power+electronic+assemblies.+Preliminary+result (literal)

Http://www.cnr.it/ontology/cnr/pubblicazioni.owl#note

• In: ThETA 2 - Thermal Issues in Emerging Technologies, Theory and Applications (Cairo, Egypt, 17-20 December 2008). Proceedings, vol. 1 pp. 317 - 324. IEEE, 2008. (literal)

Http://www.cnr.it/ontology/cnr/pubblicazioni.owl#descrizioneSinteticaDelProdotto

• ABSTRACT: The DJOSER analytical thermal solver for multilayer mounting structures has been tested as a useful and friendly tool for the thermal analysis of power electronic devices and their packages, able to replace the onerous programs based on the finite element (FEM) calculations. The other problem connected with the packaging evaluation is the calculation of the thermally induced stresses and deformations in the various layers composing the assembling structures. This paper deals with the first step of the implementation of a thermo-mechanical solver to be connected with the DJOSER program which may be able to calculate the stresses at the layer interfaces, using the same strategy, i.e. a semi-analytical mathematical approach, and the same DJOSER structural constrains (stepped pyramidal structures, homogeneous layers). The basic theory is briefly exposed and the method is applied to some two-layers virtual structures. The obtained results are compared with those obtained using standard FEM analyses, revealing a substantial agreement but also some local disagreements. (literal)

Note

• ISI Web of Science (WOS) (literal)
• Scopu (literal)

Http://www.cnr.it/ontology/cnr/pubblicazioni.owl#affiliazioni

• Dipartimento di Ingegneria dell'Informazione, Università di Pisa, CNR-ISTI, Pisa (literal)

Titolo

• Integrating a thermo-mechanical solver into the djoser analytical thermal simulator for multilayer power electronic assemblies. Preliminary result (literal)

Http://www.cnr.it/ontology/cnr/pubblicazioni.owl#isbn

• 978-1-4244-3575-3 (literal)

Abstract

• The DJOSER analytical thermal solver for multilayer mounting structures has been tested as a useful and friendly tool for the thermal analysis of power electronic devices and their packages, able to replace the onerous programs based on the finite element (FEM) calculations. The other problem connected with the packaging evaluation is the calculation of the thermally induced stresses and strains in the various layers composing the assembling structures. This paper deals with the first step of the implementation of a thermo-mechanical solver to be connected with the DJOSER program, which may be able to calculate the stresses at the layer interfaces, using the same strategy, i.e. a semi-analytical mathematical approach, and the same DJOSER structural constrains (stepped pyramidal structures, homogeneous layers). The basic theory is briefly exposed and the method is applied to some two-layers virtual structures. The obtained results are compared with those obtained using standard FEM analyses, revealing a substantial agreement but also some local disagreements. (literal)

Prodotto di

• Istituto di scienza e tecnologie dell'informazione \"Alessandro Faedo\" (ISTI) (Istituto)
• Modelli matematici e metodi numerici per la dinamica del volo e la meccanica dei solidi (ICT.P11.006.001) (Modulo)

Autore CNR

• CRISTINA PADOVANI (Unità di personale interno)
• GIUSEPPE PASQUINELLI (Persona)
• ANDREA PAGNI (Persona)

Insieme di parole chiave

• Parole chiave di "Integrating a thermo-mechanical solver into the djoser analytical thermal simulator for multilayer power electronic assemblies. Preliminary result" (Insieme di parole chiave)

Incoming links:

Prodotto

• Istituto di scienza e tecnologie dell'informazione \"Alessandro Faedo\" (ISTI) (Istituto)
• Modelli matematici e metodi numerici per la dinamica del volo e la meccanica dei solidi (ICT.P11.006.001) (Modulo)

Autore CNR di

• CRISTINA PADOVANI (Unità di personale interno)
• GIUSEPPE PASQUINELLI (Persona)
• ANDREA PAGNI (Persona)

Insieme di parole chiave di

• Parole chiave di "Integrating a thermo-mechanical solver into the djoser analytical thermal simulator for multilayer power electronic assemblies. Preliminary result" (Insieme di parole chiave)