Fast analytical thermal modeling of electronic devices and circuits with multi-layer stack mountings (Contributo in atti di convegno)

Type
Label
  • Fast analytical thermal modeling of electronic devices and circuits with multi-layer stack mountings (Contributo in atti di convegno) (literal)
Anno
  • 2003-01-01T00:00:00+01:00 (literal)
Alternative label
  • Bagnoli P.E.1, Montesi M. 2, Casarosa C. 3, Pasquinelli G. 4 (2003)
    Fast analytical thermal modeling of electronic devices and circuits with multi-layer stack mountings
    in 5th Electronic Packaging and Technology Conference, Singapore
    (literal)
Http://www.cnr.it/ontology/cnr/pubblicazioni.owl#autori
  • Bagnoli P.E.1, Montesi M. 2, Casarosa C. 3, Pasquinelli G. 4 (literal)
Http://www.cnr.it/ontology/cnr/pubblicazioni.owl#note
  • A2-67 (literal)
Titolo
  • Fast analytical thermal modeling of electronic devices and circuits with multi-layer stack mountings (literal)
Prodotto di
Autore CNR

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