Electromigration Reliability Assessment of Cu-based Metallization Systems by a Wafer-Level Approach (Contributo in atti di convegno)

Type
Label
  • Electromigration Reliability Assessment of Cu-based Metallization Systems by a Wafer-Level Approach (Contributo in atti di convegno) (literal)
Anno
  • 2007-01-01T00:00:00+01:00 (literal)
Alternative label
  • Impronta M, Marras A, De Munari I, Scorzoni A, Valentini MG (2007)
    Electromigration Reliability Assessment of Cu-based Metallization Systems by a Wafer-Level Approach
    in ECI Conference on Semiconductor Technology for Ultra Large Scale Integrated Circuits and Thin Film Transistors (ULSIC vs TFT), Barga
    (literal)
Http://www.cnr.it/ontology/cnr/pubblicazioni.owl#autori
  • Impronta M, Marras A, De Munari I, Scorzoni A, Valentini MG (literal)
Titolo
  • Electromigration Reliability Assessment of Cu-based Metallization Systems by a Wafer-Level Approach (literal)
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Autore CNR

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