On wafer multi-port linear characterization of passive structures using a standard 2-port VNA (Contributo in atti di convegno)

Type
Label
  • On wafer multi-port linear characterization of passive structures using a standard 2-port VNA (Contributo in atti di convegno) (literal)
Anno
  • 2010-01-01T00:00:00+01:00 (literal)
Alternative label
  • J. A. Lonac; I. Melczarsky; R. P. Paganelli (2010)
    On wafer multi-port linear characterization of passive structures using a standard 2-port VNA
    in 40th European Microwave Conference, Paris, France, 28-30 Sept. 2010
    (literal)
Http://www.cnr.it/ontology/cnr/pubblicazioni.owl#autori
  • J. A. Lonac; I. Melczarsky; R. P. Paganelli (literal)
Pagina inizio
  • 252 (literal)
Pagina fine
  • 255 (literal)
Http://www.cnr.it/ontology/cnr/pubblicazioni.owl#url
  • http://ieeexplore.ieee.org/xpls/abs_all.jsp?arnumber=5616600&tag=1 (literal)
Http://www.cnr.it/ontology/cnr/pubblicazioni.owl#titoloVolume
  • 40th European Microwave Conference (2010) (literal)
Rivista
Http://www.cnr.it/ontology/cnr/pubblicazioni.owl#note
  • 28-30 September 2010, pages 252–255 (literal)
Http://www.cnr.it/ontology/cnr/pubblicazioni.owl#pagineTotali
  • 4 (literal)
Note
  • Scopu (literal)
Http://www.cnr.it/ontology/cnr/pubblicazioni.owl#affiliazioni
  • MEC srl, Viale Pepoli 3/2, 40123 Bologna BO Italy ### DEIS-University of Bologna, Viale Risorgimento 2, 40136, Bologna BO Italy ### CNR-IEIIT, Viale Risorgimento 2, 40136, Bologna BO Italy (literal)
Titolo
  • On wafer multi-port linear characterization of passive structures using a standard 2-port VNA (literal)
Http://www.cnr.it/ontology/cnr/pubblicazioni.owl#isbn
  • 978-1-4244-7232-1 (literal)
Abstract
  • A simple method for the full characterization of passive n-port MMIC structures using standard 2-port Vector Network Analyzer (VNA) measurements is presented. Its main advantages are: it does not require to perform measurements from all the ports of the network, no special calibration procedure is needed, the auxiliary terminations required by the procedure can be integrated at the border of the structure under test with minimal area increase, and it can be easily implemented in commercial CAD software. The method was applied to a 9- port microstrip structure corresponding to the output power combiner and impedance matching network of an X-band MMIC Power Amplifier (HPA). The full S-parameter matrix was derived from 2-port measurements and compared to circuit as well as EM-based simulations of the structure. (literal)
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