http://www.cnr.it/ontology/cnr/individuo/prodotto/ID53904
Composition of plasma-sprayed tungsten coatings (Articolo in rivista)
- Type
- Label
- Composition of plasma-sprayed tungsten coatings (Articolo in rivista) (literal)
- Anno
- 2010-01-01T00:00:00+01:00 (literal)
- Http://www.cnr.it/ontology/cnr/pubblicazioni.owl#doi
- 10.1002/sia.3302 (literal)
- Alternative label
- Http://www.cnr.it/ontology/cnr/pubblicazioni.owl#autori
- A. Mezzi 2; S. Kaciulis 2; N. Ucciardello 1; R. Montanari 1; R. Volterri 1 (literal)
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- Note
- ISI Web of Science (WOS) (literal)
- Http://www.cnr.it/ontology/cnr/pubblicazioni.owl#affiliazioni
- (1) - Università Tor Vergata
(2) CNR - ISMN (literal)
- Titolo
- Composition of plasma-sprayed tungsten coatings (literal)
- Abstract
- Mock-ups for the International Thermonuclear Experimental Reactor(ITER) were manufactured by depositing W coatings on tubular substrates of CuCrZr alloy via plasma spraying. An appropriate interlayer (of Ni, Al and Si) was optimised to increase the adhesion of W on the Cu alloy and to provide a soft interface with intermediate thermal expansion coefficient for better thermo-mechanical compatibility.
The distribution of chemical elements in the layered interface and in the coating was investigated by energy dispersive spectroscopy (EDS), XPS and AES in the as-prepared material and after heat treatment of 24 h at 823 K. Moreover, the external W layer was examined by inductively coupled plasma emission spectrometry (ICP-ES).
The results showed that the as-prepared material does not exhibit macro-porosity. The layers forming the interface do not exhibit any long-range diffusion of the chemical species from layer to layer during the deposition process. The heat treatment does not seem to cause long-range migration of Al and Ni into the W coating.
The presence of Ni (0.4 wt%) in the as-deposited external W layer as shown by ICP-ES is only due to the low purity (commercial grade) of W powders used in spraying operations. It can be eliminated by using W powders of higher purity in the deposition process. (literal)
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