Measurements methodology for the reliability evaluation of intelligent power modules (Contributo in atti di convegno)

Type
Label
  • Measurements methodology for the reliability evaluation of intelligent power modules (Contributo in atti di convegno) (literal)
Anno
  • 2014-01-01T00:00:00+01:00 (literal)
Http://www.cnr.it/ontology/cnr/pubblicazioni.owl#doi
  • 10.1109/I2MTC.2014.6860826 (literal)
Alternative label
  • Cataliotti A.; Di Cara D.; Marsala G.; Ragusa A.; Tine G. (2014)
    Measurements methodology for the reliability evaluation of intelligent power modules
    in IEEE International Instrumentation And Measurement Technology Conference, Montevideo (Uruguay), May 12-15, 2014
    (literal)
Http://www.cnr.it/ontology/cnr/pubblicazioni.owl#autori
  • Cataliotti A.; Di Cara D.; Marsala G.; Ragusa A.; Tine G. (literal)
Pagina inizio
  • 665 (literal)
Pagina fine
  • 669 (literal)
Http://www.cnr.it/ontology/cnr/pubblicazioni.owl#url
  • http://www.scopus.com/inward/record.url?eid=2-s2.0-84905686667&partnerID=q2rCbXpz (literal)
Rivista
Note
  • ISI Web of Science (WOS) (literal)
  • Scopu (literal)
  • Google Scholar (literal)
Http://www.cnr.it/ontology/cnr/pubblicazioni.owl#affiliazioni
  • Dep. of Energy, Information Engineering and Mathematic, Models (DEIM), Università di Palermo, Viale delle Scienze, 90128 Palermo, Italy; National Research Council (CNR), Institute of Intelligent System for Automation (ISSIA), Via Dante Alighieri, 12, 90141 Palermo, Italy (literal)
Titolo
  • Measurements methodology for the reliability evaluation of intelligent power modules (literal)
Http://www.cnr.it/ontology/cnr/pubblicazioni.owl#isbn
  • 978-1-4673-6385-3 (literal)
Abstract
  • The paper describes a measurement methodology for the reliability evaluation of new intelligent power electronics modules (IPMs). In particular, the evaluation of the IPMs immunity to radio frequency conducted disturbances has been performed, at different operating thermal conditions, designing a suitable measurement set up in a shielded room. Moreover, the thermal performances of the devices have been analyzed, setting up a proper experimental test bench. The measurements procedures are detailed described. © 2014 IEEE. (literal)
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