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COST Action MP0602 - Handbook of High-Temperature Lead-Free Soldering Systems: Materials Properties, Vol.2, Chapter 3: GP9 - - AuGe based alloys as potential high temperature lead free solders (Contributo in volume (capitolo o saggio))

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COST Action MP0602 - Handbook of High-Temperature Lead-Free Soldering Systems: Materials Properties, Vol.2, Chapter 3: GP9 - - AuGe based alloys as potential high temperature lead free solders (Contributo in volume (capitolo o saggio)) (literal)

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Leinenbach C., Jin S., Wang J., Elsener H., Valenza F., Giuranno D., Novakovic R., Delsante S., Borzone G., Scott A., Watson A. (2012)
COST Action MP0602 - Handbook of High-Temperature Lead-Free Soldering Systems: Materials Properties, Vol.2, Chapter 3: GP9 - - AuGe based alloys as potential high temperature lead free solders
European Science Foundation, Bruxelles (Belgio) in COST Action MP0602 - Handbook of High-Temperature Lead-Free Soldering Systems: Materials Properties, 2012
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Leinenbach C., Jin S., Wang J., Elsener H., Valenza F., Giuranno D., Novakovic R., Delsante S., Borzone G., Scott A., Watson A. (literal)

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Empa-Materials Science and Technology, Überlandstrasse 129, 8600 Dübendorf, Switzerland; National Research Council (CNR) - Institute for Energetics and Interphases (IENI), Genoa, Italy; Department of Chemistry and Industrial Chemistry, University of Genova, Italy; Institute for Materials Research, University of Leeds, Leeds LS2 9JT, UK (literal)

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COST Action MP0602 - Handbook of High-Temperature Lead-Free Soldering Systems: Materials Properties, Vol.2, Chapter 3: GP9 - - AuGe based alloys as potential high temperature lead free solders (literal)

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Leinenbach C., Jin S., Wang J., Elsener H., Valenza F., Giuranno D., Novakovic R., Delsante S., Borzone G., Scott A., Watson A. (literal)

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Abstract

This chapter covers both fundamental investigations and application studies of the Au-Ge based alloys as potential high temperature Pb-free solders. Section 2 is the fundamental part, mainly focusing on the thermodynamic modelling of the Au-Ge based Pb-free solders system, where possible additions, such as Sb, Sn, Si and substrate materials, such as Cu, Ni, Si are included. Afterwards the applications of using Au-Ge alloys as high temperature Pb-free solder will be demonstrated. The wettability and soldering behaviour of the Au-Ge eutectic alloy (Au-28 at.% Ge) on Cu and Ni substrates will be shown in Section 3 and Section 4, respectively. In section 5, an application example - a heated conversion surface assembly for a mass spectrometer - will be presented. (literal)

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