Interfacial reactions in the Sb-Sn / (Cu, Ni) systems: wetting experiments (Articolo in rivista)

Type
Label
  • Interfacial reactions in the Sb-Sn / (Cu, Ni) systems: wetting experiments (Articolo in rivista) (literal)
Anno
  • 2012-01-01T00:00:00+01:00 (literal)
Http://www.cnr.it/ontology/cnr/pubblicazioni.owl#doi
  • 10.1016/j.matchemphys.2012.09.028 (literal)
Alternative label
  • Novakovic R.; Lanata T.;Delsante S.; Borzone G. (2012)
    Interfacial reactions in the Sb-Sn / (Cu, Ni) systems: wetting experiments
    in Materials chemistry and physics (Print); Elsevier BV, Amsterdam (Paesi Bassi)
    (literal)
Http://www.cnr.it/ontology/cnr/pubblicazioni.owl#autori
  • Novakovic R.; Lanata T.;Delsante S.; Borzone G. (literal)
Pagina inizio
  • 458 (literal)
Pagina fine
  • 465 (literal)
Http://www.cnr.it/ontology/cnr/pubblicazioni.owl#url
  • http://dx.doi.org/10.1016/j.matchemphys.2012.09.028 (literal)
Http://www.cnr.it/ontology/cnr/pubblicazioni.owl#numeroVolume
  • 137 (literal)
Rivista
Http://www.cnr.it/ontology/cnr/pubblicazioni.owl#pagineTotali
  • 8 (literal)
Http://www.cnr.it/ontology/cnr/pubblicazioni.owl#numeroFascicolo
  • 2 (literal)
Note
  • ISI Web of Science (WOS) (literal)
  • Scopu (literal)
Http://www.cnr.it/ontology/cnr/pubblicazioni.owl#affiliazioni
  • 1,2 : National Research Council (CNR), Institute for Energetics and Interphases (IENI), Via De Marini, 6, 16149 Genoa, Italy / 3,4 : DCCI-University of Genoa, Via Dodecaneso, 31, 16146-Genoa, Italy (literal)
Titolo
  • Interfacial reactions in the Sb-Sn / (Cu, Ni) systems: wetting experiments (literal)
Abstract
  • Interfacial reactions in the Sb-Sn/Cu and Sb-Sn/Ni systems have been investigated by means of wetting experiments. The wetting behaviour of two lead-free alloys, namely, Sb2.5Sn97.5 and Sb14.5Sn85.5 (at.%), in contact with Cu and Ni-substrates has been studied in view of possible applications as high-temperature solders in the electronics industry. The contact angle measurements on Cu and Ni plates were performed by using a sessile drop apparatus. The solder/substrate interface was characterised by the SEM-EDS analyses. (literal)
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