http://www.cnr.it/ontology/cnr/individuo/prodotto/ID210345
Potentialities of nickel oxide as dielectric for GaN and SiC devices (Articolo in rivista)
- Type
- Label
- Potentialities of nickel oxide as dielectric for GaN and SiC devices (Articolo in rivista) (literal)
- Anno
- 2013-01-01T00:00:00+01:00 (literal)
- Http://www.cnr.it/ontology/cnr/pubblicazioni.owl#doi
- 10.4028/www.scientific.net/MSF.740-742.777 (literal)
- Alternative label
R. Lo Nigro, G. Greco, L. Swanson, G. Fisichella, P. Fiorenza, F. Giannazzo, S. Di Franco, C. Bongiorno, A. Marino, G. Malandrino, F. Roccaforte (2013)
Potentialities of nickel oxide as dielectric for GaN and SiC devices
in Materials science forum
(literal)
- Http://www.cnr.it/ontology/cnr/pubblicazioni.owl#autori
- R. Lo Nigro, G. Greco, L. Swanson, G. Fisichella, P. Fiorenza, F. Giannazzo, S. Di Franco, C. Bongiorno, A. Marino, G. Malandrino, F. Roccaforte (literal)
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- NetFISiC, Ambition Power, LAST POWER (literal)
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- ISI Web of Science (WOS) (literal)
- Http://www.cnr.it/ontology/cnr/pubblicazioni.owl#affiliazioni
- CNR-IMM, Catania, Italy
Scuola Superiore di Catania - University of Catania, Italy
Department of Physics and Astronomy, University of Catania, Italy
Department of Electronic Engineering, University of Catania, Italy
Department of Chemistry, University of Catania, Italy (literal)
- Titolo
- Potentialities of nickel oxide as dielectric for GaN and SiC devices (literal)
- Abstract
- This paper reports on a structural and electrical analysis of nickel oxide (NiO) films grown both on AlGaN/GaN heterostructures and on 4H-SiC epilayers. The films were grown by metal organic chemical vapor deposition (MOCVD). The structural analysis showed epitaxially oriented films over the hexagonal substrates. The electrical characterization of simple devices onto AlGaN/GaN heterostructures enabled to demonstrate a dielectric constant of 11.7 and a reduction of the leakage current in insulated gate structures. On the other hand, epitaxial NiO films grown onto 4H-SiC epilayers exhibited the presence of an interfacial SiO2 layer and twinned NiO grains, and a lower dielectric constant. (literal)
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