Fabrication of AlN/Si SAW delay lines with very low RF signal noise (Articolo in rivista)

Type
Label
  • Fabrication of AlN/Si SAW delay lines with very low RF signal noise (Articolo in rivista) (literal)
Anno
  • 2007-01-01T00:00:00+01:00 (literal)
Alternative label
  • Ingrosso, I; Petroni, S; Altamura, D; De Vittorio, M; Combi, C; Passaseo, A (2007)
    Fabrication of AlN/Si SAW delay lines with very low RF signal noise
    in Microelectronic engineering
    (literal)
Http://www.cnr.it/ontology/cnr/pubblicazioni.owl#autori
  • Ingrosso, I; Petroni, S; Altamura, D; De Vittorio, M; Combi, C; Passaseo, A (literal)
Pagina inizio
  • 1320 (literal)
Pagina fine
  • 1324 (literal)
Http://www.cnr.it/ontology/cnr/pubblicazioni.owl#numeroVolume
  • 84 (literal)
Rivista
Note
  • ISI Web of Science (WOS) (literal)
Http://www.cnr.it/ontology/cnr/pubblicazioni.owl#affiliazioni
  • Univ Lecce, CNR, Natl Nanotechnol Labs, INFM,ISUFI, I-73100 Lecce, Italy; STMicroelect, I-73100 Lecce, Italy; CNR, I-73100 Lecce, Italy (literal)
Titolo
  • Fabrication of AlN/Si SAW delay lines with very low RF signal noise (literal)
Abstract
  • In this work we investigate the influence of the substrate resistivity and of different buffer layers on the out-of-band insertion losses in AIN SAW devices fabricated on (100) silicon substrates. The measurements have shown that the out-of-band insertion loss is improved by increasing the substrate resistivity but also by the introduction of an insulating buffer layer material. An out-of-band insertion loss as low as -75 dB has been achieved by the device realized on a silicon nitride buffer layer. This can be explained in terms of inhibition of the diffusion of silicon atoms in the AIN film. Our results show that silicon nitride represents a good solution in terms of low out-of-band insertion loss and cost effectiveness for the realization of nitride-based piezoelectric MEMS devices on silicon substrates. (c) 2007 Elsevier B.V. All rights reserved. (literal)
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