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Piezoelectrically actuated MEMS microswitches for high current applications (Articolo in rivista)

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Piezoelectrically actuated MEMS microswitches for high current applications (Articolo in rivista) (literal)

Anno

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Alternative label

Balma, Davide 1, Lamberti, Andrea 1,2, Marasso, Simone Luigi 1, Perrone, Denis 1, Quaglio, Marzia 2, Canavese, Giancarlo 2, Bianco, Stefano 2, Cocuzza, Matteo 1,3 (2011)
Piezoelectrically actuated MEMS microswitches for high current applications
in Microelectronic engineering; Elsevier, Amsterdam (Paesi Bassi)
(literal)

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Balma, Davide 1, Lamberti, Andrea 1,2, Marasso, Simone Luigi 1, Perrone, Denis 1, Quaglio, Marzia 2, Canavese, Giancarlo 2, Bianco, Stefano 2, Cocuzza, Matteo 1,3 (literal)

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Proceedings of the 36th International Conference on Micro- and Nano-Engineering (MNE), 36th International Conference on Micro- and Nano-Engineering (MNE) / ID_PUMA: cnr.imem/2011-A0-020 (literal)

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[ 1 ] Politecn Torino, Dept Mat Sci & Chem Engn, Mat & Microsyst Lab, Xlab,Latemar Unit, IT-10034 Turin, Italy; [ 2 ] Italian Inst Technol, Ctr Space Human Robot, IT-10129 Turin, Italy; [ 3 ] CNR IMEM, IT-43124 Parma, Italy (literal)

Titolo

Piezoelectrically actuated MEMS microswitches for high current applications (literal)

Abstract

In this work the fabrication of a piezoelectrically actuated microswitch for high current applications is proposed. In particular, the microswitch was properly designed to drive currents of the order of 1 A. The device was obtained assembling two silicon substrates: one containing the signal lines and the other enclosing a silicon nitride microcantilever. This latter operates as a switch by closing the circuit with a multilayered metal electrode on its tip. Four layers of lead zirconate titanate (PZT), deposited by sol-gel method, constitute the actuation element of the microcantilever. The bottom and top electrodes of the PZT were respectively made of thin Ti/Pt and Ti/Au layers, deposited by electron beam evaporation. The signal lines and the contact-electrode on the microcantilever tip were made of Ti/Ni/Au/Cu (with a total thickness of about 1 lm). The two substrates were finally bonded together by Au/Sn eutectic bonding. (literal)

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