A thermomechanical solver for multilayer power electronic assemblies integrated into the DJOSER thermal simulator (Articolo in rivista)

Type

• Prodotto della ricerca (Classe)
• Articolo in rivista (Classe)

Label

• A thermomechanical solver for multilayer power electronic assemblies integrated into the DJOSER thermal simulator (Articolo in rivista) (literal)

Anno

• 2011-01-01T00:00:00+01:00 (literal)

Http://www.cnr.it/ontology/cnr/pubblicazioni.owl#doi

• 10.1115/1.4003516 (literal)

Alternative label

• Bagnoli P.E., Padovani C., Pagni A., Pasquinelli G. (2011)
  A thermomechanical solver for multilayer power electronic assemblies integrated into the DJOSER thermal simulator
  in Journal of electronic packaging
  (literal)

Http://www.cnr.it/ontology/cnr/pubblicazioni.owl#autori

• Bagnoli P.E., Padovani C., Pagni A., Pasquinelli G. (literal)

Pagina inizio

• 011005-1 (literal)

Pagina fine

• 011005-7 (literal)

Http://www.cnr.it/ontology/cnr/pubblicazioni.owl#altreInformazioni

• Paolo Emilio Bagnoli, Cristina Padovani, Andrea Pagni, Giuseppe Pasquinelli (literal)

Http://www.cnr.it/ontology/cnr/pubblicazioni.owl#url

• http://asmedl.org/getabs/servlet/GetabsServlet?prog=normal&id=JEPAE4000133000001011005000001&idtype=cvips&gifs=yes&ref=no (literal)

Http://www.cnr.it/ontology/cnr/pubblicazioni.owl#numeroVolume

• 133 (literal)

Rivista

• Journal of electronic packaging (Rivista)

Http://www.cnr.it/ontology/cnr/pubblicazioni.owl#numeroFascicolo

• 1 (literal)

Note

• Scopu (literal)
• PuMa (literal)
• ISI Web of Science (WOS) (literal)

Http://www.cnr.it/ontology/cnr/pubblicazioni.owl#affiliazioni

• Department of Information Engineering, University of Pisa, Pisa 56100, Italy; CNR-ISTI, Pisa, Italy (literal)

Titolo

• A thermomechanical solver for multilayer power electronic assemblies integrated into the DJOSER thermal simulator (literal)

Abstract

• The DJOSER analytical thermal solver for multilayer mounting structures has been tested as a useful and friendly tool for the thermal analysis of power electronic devices and their packages, able to replace the onerous programs based on the finite element method (FEM) calculations. The other problem connected with the packaging evaluation is the calculation of the thermally induced stresses and strains in the various layers composing the assembling structures. This paper deals with the first step of the implementation of a thermomechanical solver to be connected with the DJOSER program, which is able to calculate the stresses at the layer interfaces, using the same strategy, i.e., a semianalytical mathematical approach, as well as the same structural models (stepped pyramidal structures and homogeneous layers). The basic theory is briefly exposed and the method is applied to some two-layer virtual structures. The obtained results are compared with those obtained using standard FEM analyses. (literal)

Prodotto di

• Istituto di scienza e tecnologie dell'informazione \"Alessandro Faedo\" (ISTI) (Istituto)
• Modelli matematici e metodi numerici per la dinamica del volo e la meccanica dei solidi (ICT.P11.006.001) (Modulo)

Autore CNR

• GIUSEPPE PASQUINELLI (Persona)
• ANDREA PAGNI (Persona)
• CRISTINA PADOVANI (Unità di personale interno)

Incoming links:

Prodotto

• Istituto di scienza e tecnologie dell'informazione \"Alessandro Faedo\" (ISTI) (Istituto)
• Modelli matematici e metodi numerici per la dinamica del volo e la meccanica dei solidi (ICT.P11.006.001) (Modulo)

Autore CNR di

• CRISTINA PADOVANI (Unità di personale interno)
• GIUSEPPE PASQUINELLI (Persona)
• ANDREA PAGNI (Persona)

Http://www.cnr.it/ontology/cnr/pubblicazioni.owl#rivistaDi

• Journal of electronic packaging (Rivista)