Keywords of "Structural, Morphological, and Chemical Properties of Cu/TiN Versus Cu Thin Layers for HEMT Backside Metallization"
- Label
- Keywords of "Structural, Morphological, and Chemical Properties of Cu/TiN Versus Cu Thin Layers for HEMT Backside Metallization" (literal)
- Parole chiave di "Structural, Morphological, and Chemical Properties of Cu/TiN Versus Cu Thin Layers for HEMT Backside Metallization" (literal)
- Insieme di parole chiave di
- Structural, Morphological, and Chemical Properties of Cu/TiN Versus Cu Thin Layers for HEMT Backside Metallization (Articolo in rivista) (http://www.cnr.it/ontology/cnr/individuo/prodotto/TIPO1101)
- Ha membro
- Copper (Parola chiave)
- titanium compounds (Parola chiave)
- scanning electron microscopy (Parola chiave)
- integrated circuit metallization (Parola chiave)
- diffusion processes (Parola chiave)
Incoming links:
- Insieme di parole chiave
- Structural, Morphological, and Chemical Properties of Cu/TiN Versus Cu Thin Layers for HEMT Backside Metallization (Articolo in rivista) (http://www.cnr.it/ontology/cnr/individuo/prodotto/TIPO1101)
- Membro di
- Copper (Parola chiave)
- titanium compounds (Parola chiave)
- scanning electron microscopy (Parola chiave)
- integrated circuit metallization (Parola chiave)
- diffusion processes (Parola chiave)
