Microstrip Transducers Optimisation for Band Pass Micropackaged Magnetostatic Wave Resonators (Contributo in atti di convegno)

Type
Label
  • Microstrip Transducers Optimisation for Band Pass Micropackaged Magnetostatic Wave Resonators (Contributo in atti di convegno) (literal)
Anno
  • 2004-01-01T00:00:00+01:00 (literal)
Http://www.cnr.it/ontology/cnr/pubblicazioni.owl#doi
  • 10.1109/SMICND.2004.1402832 (literal)
Alternative label
  • Cismaru A., Marcelli R., Sajin G., Craciunoiu F. (2004)
    Microstrip Transducers Optimisation for Band Pass Micropackaged Magnetostatic Wave Resonators
    in 2004 International Semiconductor Conference, IEEE CAS 2004, Sinaia, Romania, 4-6 October 2004
    (literal)
Http://www.cnr.it/ontology/cnr/pubblicazioni.owl#autori
  • Cismaru A., Marcelli R., Sajin G., Craciunoiu F. (literal)
Pagina inizio
  • 173 (literal)
Pagina fine
  • 176 (literal)
Http://www.cnr.it/ontology/cnr/pubblicazioni.owl#titoloVolume
  • Proceedings of the 2004 International Semiconductor Conference, IEEE CAS 2004 (literal)
Http://www.cnr.it/ontology/cnr/pubblicazioni.owl#pagineTotali
  • 4 (literal)
Note
  • ISI Web of Science (WOS) (literal)
Http://www.cnr.it/ontology/cnr/pubblicazioni.owl#affiliazioni
  • CNR-IMM Roma Nat. Institute for Micro- and Nano-Technologies, Bucuresti, Romania (literal)
Titolo
  • Microstrip Transducers Optimisation for Band Pass Micropackaged Magnetostatic Wave Resonators (literal)
Http://www.cnr.it/ontology/cnr/pubblicazioni.owl#isbn
  • 0-7803-8499-7 (literal)
Http://www.cnr.it/ontology/cnr/pubblicazioni.owl#autoriVolume
  • AA.VV. (literal)
Http://www.cnr.it/ontology/cnr/pubblicazioni.owl#curatoriVolume
  • Editors: Dan Dascalu, General Chairman; Adrian Rusu, Technical Program Chair (literal)
Abstract
  • In this paper the design of microstrip line configurations to be used for band pass magneto static wave resonators on silicon microprocessed substrates has been studied. Two configurations have been simulated: (i) grounded microstrip lines and (ii) loaded ones by 50 ? resistors. Microprocessing of the substrate is proposed to improve the micropackaging of the resonator and its electrical matching with the transducers. Further to the improvement expected from the microprocessing allows a better isolation for broadband applications. (literal)
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