Technology and test of coplanar grounded wave-guides on micro-machined Si wafers (Contributo in atti di convegno)

Type
Label
  • Technology and test of coplanar grounded wave-guides on micro-machined Si wafers (Contributo in atti di convegno) (literal)
Anno
  • 2008-01-01T00:00:00+01:00 (literal)
Http://www.cnr.it/ontology/cnr/pubblicazioni.owl#doi
  • 10.1109/SMICND.2008.4703374 (literal)
Alternative label
  • Lucibello A, De Angelis G, Proietti E, Marcelli R, Bartolucci G (2008)
    Technology and test of coplanar grounded wave-guides on micro-machined Si wafers
    in International Semiconductor Conference, IEEE CAS 2008, Sinaia, Romania, October 13 - 15, 2008
    (literal)
Http://www.cnr.it/ontology/cnr/pubblicazioni.owl#autori
  • Lucibello A, De Angelis G, Proietti E, Marcelli R, Bartolucci G (literal)
Pagina inizio
  • 219 (literal)
Pagina fine
  • 222 (literal)
Http://www.cnr.it/ontology/cnr/pubblicazioni.owl#titoloVolume
  • Proceedings of the International Semiconductor Conference, IEEE CAS 2008 (literal)
Http://www.cnr.it/ontology/cnr/pubblicazioni.owl#pagineTotali
  • 4 (literal)
Note
  • ISI Web of Science (WOS) (literal)
Http://www.cnr.it/ontology/cnr/pubblicazioni.owl#affiliazioni
  • CNR-IMM Roma University of Roma \"Tor Vergata\" (literal)
Titolo
  • Technology and test of coplanar grounded wave-guides on micro-machined Si wafers (literal)
Http://www.cnr.it/ontology/cnr/pubblicazioni.owl#isbn
  • 978-1-4244-2004-9 (literal)
Http://www.cnr.it/ontology/cnr/pubblicazioni.owl#autoriVolume
  • AA.VV. (literal)
Http://www.cnr.it/ontology/cnr/pubblicazioni.owl#curatoriVolume
  • Editors: Dan Dascalu, General Chairman and Adrian Rusu, Technical Program Chair (literal)
Abstract
  • Coplanar wave-guide grounded lines (CPWG) have been designed, realized by micromachining of high resistivity silicon wafers and testedup to 40 GHz. Different configurations have beencompared between them by changing the dimensions of the micro-machined via-holes used for the groundconnection, as well as their number and separation, to get the optimal electrical matching conditions. Wide-band matching and losses as low as 0.1-0.2dB/mm have been obtained within the 40 GHz range, in agreement with the predicted behaviour. (literal)
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