Fast thermal nanoimprint lithography by a stamp with integrated heater (Articolo in rivista)

Type
Label
  • Fast thermal nanoimprint lithography by a stamp with integrated heater (Articolo in rivista) (literal)
Anno
  • 2008-01-01T00:00:00+01:00 (literal)
Http://www.cnr.it/ontology/cnr/pubblicazioni.owl#doi
  • 10.1016/j.mee.2008.01.065 (literal)
Alternative label
  • Tormen, M; Malureanu, R; Pedersen, RH; Lorenzen, L; Rasmussen, KH; Luscher, CJ; Kristensen, A; Hansen, O (2008)
    Fast thermal nanoimprint lithography by a stamp with integrated heater
    in Microelectronic engineering
    (literal)
Http://www.cnr.it/ontology/cnr/pubblicazioni.owl#autori
  • Tormen, M; Malureanu, R; Pedersen, RH; Lorenzen, L; Rasmussen, KH; Luscher, CJ; Kristensen, A; Hansen, O (literal)
Pagina inizio
  • 1229 (literal)
Pagina fine
  • 1232 (literal)
Http://www.cnr.it/ontology/cnr/pubblicazioni.owl#numeroVolume
  • 85 (literal)
Rivista
Note
  • ISI Web of Science (WOS) (literal)
Http://www.cnr.it/ontology/cnr/pubblicazioni.owl#affiliazioni
  • \"[Tormen, Massimo; Malureanu, Radu] Natl Inst Phys Matter, TASC Lab, I-34012 Basovizza Trieste, Italy; [Pedersen, Rasmus Haugstrup; Lorenzen, Lasse; Rasmussen, Kristian Hagsted; Luscher, Christopher James; Kristensen, Anders; Hansen, Ole] Tech Univ Denmark, MIC Dept Micro & Nanotechnol, DK-2800 Lyngby, Denmark; [Hansen, Ole] Tech Univ Denmark, CINF, DK-2800 Lyngby, Denmark (literal)
Titolo
  • Fast thermal nanoimprint lithography by a stamp with integrated heater (literal)
Abstract
  • We propose fast nanoimprinting lithography (NIL) process based on the use of stamps with integrated heater. The latter consists of heavily ion implantation n-type doped silicon layer buried below the microstructured surface of the stamp. The stamp is heated by Joule effect, by 50 mu s 25 Hz repetition rate current pulses flowing in the conductive layer. Using this approach we have reproducibly imprinted areas of similar to 2 cm(2) within 16 s with residual layers in the range of few tens of nm. This result paves the way for processes in the sub-1 s timescale over large area surfaces. (C) 2008 Elsevier B.V. All rights reserved. (literal)
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