Near-surface processing on AlGaN/GaN heterostructures: a nanoscale electrical and structural characterization (Articolo in rivista)

Type
Label
  • Near-surface processing on AlGaN/GaN heterostructures: a nanoscale electrical and structural characterization (Articolo in rivista) (literal)
Anno
  • 2011-01-01T00:00:00+01:00 (literal)
Alternative label
  • Greco G, Giannazzo F, Frazzetto A, Raineri V, Roccaforte F (2011)
    Near-surface processing on AlGaN/GaN heterostructures: a nanoscale electrical and structural characterization
    in Nanoscale research letters (Print)
    (literal)
Http://www.cnr.it/ontology/cnr/pubblicazioni.owl#autori
  • Greco G, Giannazzo F, Frazzetto A, Raineri V, Roccaforte F (literal)
Pagina inizio
  • 132 (literal)
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  • 6 (literal)
Rivista
Note
  • ISI Web of Science (WOS) (literal)
Http://www.cnr.it/ontology/cnr/pubblicazioni.owl#affiliazioni
  • 1. Ist Microelettron & Microsistemi CNR IMM, Consiglio Nazl Ric, I-95121 Catania, Italy 2. Univ Catania, Scuola Super Catania, I-95124 Catania, Italy (literal)
Titolo
  • Near-surface processing on AlGaN/GaN heterostructures: a nanoscale electrical and structural characterization (literal)
Abstract
  • The effects of near-surface processing on the properties of AlGaN/GaN heterostructures were studied, combining conventional electrical characterization on high-electron mobility transistors (HEMTs), with advanced characterization techniques with nanometer scale resolution, i.e., transmission electron microscopy, atomic force microscopy (AFM) and conductive atomic force microscopy (C-AFM). In particular, a CHF(3)-based plasma process in the gate region resulted in a shift of the threshold voltage in HEMT devices towards less negative values. Two-dimensional current maps acquired by C-AFM on the sample surface allowed us to monitor the local electrical modifications induced by the plasma fluorine incorporated in the material. The results are compared with a recently introduced gate control processing: the local rapid thermal oxidation process of the AlGaN layer. By this process, a controlled thin oxide layer on surface of AlGaN can be reliably introduced while the resistance of the layer below increase locally. (literal)
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