Analysis of self-heating related instability in n-channel polysilicon thin film transistors fabricated on polyimide (Articolo in rivista)

Type
Label
  • Analysis of self-heating related instability in n-channel polysilicon thin film transistors fabricated on polyimide (Articolo in rivista) (literal)
Anno
  • 2009-01-01T00:00:00+01:00 (literal)
Alternative label
  • Maiolo L, Cuscuna M, Mariucci L, Minotti A, Pecora A, Simeone D, Valletta A, Fortunato G (2009)
    Analysis of self-heating related instability in n-channel polysilicon thin film transistors fabricated on polyimide
    in Thin solid films (Print)
    (literal)
Http://www.cnr.it/ontology/cnr/pubblicazioni.owl#autori
  • Maiolo L, Cuscuna M, Mariucci L, Minotti A, Pecora A, Simeone D, Valletta A, Fortunato G (literal)
Pagina inizio
  • 6371 (literal)
Pagina fine
  • 6374 (literal)
Http://www.cnr.it/ontology/cnr/pubblicazioni.owl#numeroVolume
  • 517 (literal)
Rivista
Note
  • ISI Web of Science (WOS) (literal)
Http://www.cnr.it/ontology/cnr/pubblicazioni.owl#affiliazioni
  • IMM-Roma (literal)
Titolo
  • Analysis of self-heating related instability in n-channel polysilicon thin film transistors fabricated on polyimide (literal)
Abstract
  • In this work, we investigated self-heating related instability in polysilicon thin film transistors (poly-Si TFTs) fabricated on polyimide (PI) substrates. Indeed, when joule heating becomes relevant, the temperature of the active layer can substantially rise, since the devices are fabricated on thermally insulating substrates. As a result, electrical instability is triggered and attributed to the generation of interface states, due to the Si-H bond breaking, and charge trapping into the gate insulator. In addition, by using 3-dimensional numerical simulations, coupling the thermodynamic and transport models, we analyzed the temperature distribution of the device under operating conditions and found that self-heating is more severe for devices fabricated on plastic substrates. (literal)
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