Flexible tag microlab development: Gas sensors integration in RFID flexible tags for food logistic (Articolo in rivista)

Type
Label
  • Flexible tag microlab development: Gas sensors integration in RFID flexible tags for food logistic (Articolo in rivista) (literal)
Anno
  • 2007-01-01T00:00:00+01:00 (literal)
Http://www.cnr.it/ontology/cnr/pubblicazioni.owl#doi
  • 10.1016/j.snb.2007.07.007 (literal)
Alternative label
  • Abad E; Zampolli S; Marco S; Scorzoni A; Mazzolai B; Juarros A; Gomez D; Elmi I; Cardinali GC; Gomez JM; Palacio F; Cicioni M; Mondini A; Becker T; Sayhan I (2007)
    Flexible tag microlab development: Gas sensors integration in RFID flexible tags for food logistic
    in Sensors and actuators. B, Chemical (Print)
    (literal)
Http://www.cnr.it/ontology/cnr/pubblicazioni.owl#autori
  • Abad E; Zampolli S; Marco S; Scorzoni A; Mazzolai B; Juarros A; Gomez D; Elmi I; Cardinali GC; Gomez JM; Palacio F; Cicioni M; Mondini A; Becker T; Sayhan I (literal)
Pagina inizio
  • 2 (literal)
Pagina fine
  • 7 (literal)
Http://www.cnr.it/ontology/cnr/pubblicazioni.owl#numeroVolume
  • 127 (literal)
Rivista
Note
  • ISI Web of Science (WOS) (literal)
  • Scopu (literal)
Http://www.cnr.it/ontology/cnr/pubblicazioni.owl#affiliazioni
  • Micro and Nanotechnology Department, Fundacicon Tekniker, Eibar, Spain CNR-IMM Sezione di Bologna, Italy Universitat de Barcelona, Spain DIEI, University Perugia, Italy SSSA CRIM lab, Pisa, Italy EADS Deutschland GmbH, Corporate Research Centre, Munchen, Germany (literal)
Titolo
  • Flexible tag microlab development: Gas sensors integration in RFID flexible tags for food logistic (literal)
Abstract
  • The enabling technologies for the development of a flexible tag microlab for food monitoring during the logistic chain will be presented. The realisation of the system includes the integration of physical and chemical sensors with Radio Frequency IDentification (RFID) communication capabilities. The first ISO 15693 compliant semi-active tag prototype, including low power control electronics, RFID antenna, commercial sensors, memory and a thin film battery, is shown together with the development of novel ultra-low power hotplates required for this application and the process, based on the use of anisotropic conductive adhesive (ACA) flip chip technology, for gas sensors integration onto flexible substrates. (literal)
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