Numerical analysis of the process-induced stresses in silicon microstructures: application to micromachined cantilever (Articolo in rivista)

Type
Label
  • Numerical analysis of the process-induced stresses in silicon microstructures: application to micromachined cantilever (Articolo in rivista) (literal)
Anno
  • 2006-01-01T00:00:00+01:00 (literal)
Alternative label
  • Senez V, Hoffmann T, Armigliato A, De Wolf I (2006)
    Numerical analysis of the process-induced stresses in silicon microstructures: application to micromachined cantilever
    in Smart materials and structures (Print)
    (literal)
Http://www.cnr.it/ontology/cnr/pubblicazioni.owl#autori
  • Senez V, Hoffmann T, Armigliato A, De Wolf I (literal)
Pagina inizio
  • 47 (literal)
Pagina fine
  • 56 (literal)
Http://www.cnr.it/ontology/cnr/pubblicazioni.owl#numeroVolume
  • 15 (literal)
Rivista
Note
  • ISI Web of Science (WOS) (literal)
Http://www.cnr.it/ontology/cnr/pubblicazioni.owl#affiliazioni
  • Univ Tokyo, LIMMS, CNRS, IIS,Meguro Ku, Tokyo 1538505, Japan; Univ Lille, IEMN, CNRS, F-59652 Villeneuve Dascq, France; CNR, IMM, I-40129 Bologna, Italy; IMECvzw, B-3001 Louvain, Belgium (literal)
Titolo
  • Numerical analysis of the process-induced stresses in silicon microstructures: application to micromachined cantilever (literal)
Abstract
  • A technology computer aided design homemade tool, IMPACT, is described. The mechanical models and the numerical implementation are presented. Details are given about the methodology to calibrate and validate the implementation. This tool is used for the analysis of the processing of a micromachined cantilever. The originality of the study lies in (i) the capability to Simulate almost all the Sources of stress taking into account the complex rheological behaviours of the materials, (ii) the experimental determination of the mechanical properties of various thin film materials, and (iii) the validation of the calculations by direct comparisons with the measured deformations of the cantilever. (literal)
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