Improving spatial resolution of convergent beam electron diffraction strain mapping in silicon microstructures (Articolo in rivista)

Type
Label
  • Improving spatial resolution of convergent beam electron diffraction strain mapping in silicon microstructures (Articolo in rivista) (literal)
Anno
  • 2005-01-01T00:00:00+01:00 (literal)
Http://www.cnr.it/ontology/cnr/pubblicazioni.owl#doi
  • 10.1063/1.1855408 (literal)
Alternative label
  • Armigliato A., Balboni R., Frabboni S. (2005)
    Improving spatial resolution of convergent beam electron diffraction strain mapping in silicon microstructures
    in Applied physics letters; American Institute Of Physics (AIP), Melville (Stati Uniti d'America)
    (literal)
Http://www.cnr.it/ontology/cnr/pubblicazioni.owl#autori
  • Armigliato A., Balboni R., Frabboni S. (literal)
Pagina inizio
  • 063508 (literal)
Pagina fine
  • 063510 (literal)
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  • 86 (literal)
Rivista
Http://www.cnr.it/ontology/cnr/pubblicazioni.owl#pagineTotali
  • 3 (literal)
Http://www.cnr.it/ontology/cnr/pubblicazioni.owl#numeroFascicolo
  • 6 (literal)
Note
  • Scopu (literal)
  • ISI Web of Science (WOS) (literal)
Http://www.cnr.it/ontology/cnr/pubblicazioni.owl#affiliazioni
  • CNR, IMM, Sez Bologna, I-40129 Bologna, Italy; INFM S3, I-41100 Modena, Italy; Univ Modena & Reggio Emilia, I-41100 Modena, Italy (literal)
Titolo
  • Improving spatial resolution of convergent beam electron diffraction strain mapping in silicon microstructures (literal)
Abstract
  • Despite the use of nanometer-sized probes in field emission transmission electron microscopes, the spatial resolution in strain analysis performed by convergent beam electron diffraction is limited in one direction by the need for tilting the cross-sectional sample in the electron microscope off the vertical <110> direction. We demonstrate that it is possible to improve this resolution by using the <340> zone axis, instead of the <230> one, which has recently become of common use in the analysis of silicon microdevices. Quantitative strain information with good sensitivity and accuracy can be obtained in the new axis. An example of application to the two-dimensional strain mapping in shallow trench isolation structures, obtained with a scanning attachment and a high-angle annular dark-field detector, is reported. (literal)
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