http://www.cnr.it/ontology/cnr/individuo/prodotto/ID35188
Two-dimensional effects on ultralow energy B implants in Si (Articolo in rivista)
- Type
- Label
- Two-dimensional effects on ultralow energy B implants in Si (Articolo in rivista) (literal)
- Anno
- 2002-01-01T00:00:00+01:00 (literal)
- Http://www.cnr.it/ontology/cnr/pubblicazioni.owl#doi
- 10.1116/1.1424277 (literal)
- Alternative label
Giannazzo F., Priolo F., Raineri V., Privitera V., Picariello A., Battaglia A., Moffat S. (2002)
Two-dimensional effects on ultralow energy B implants in Si
in Journal of vacuum science & technology. B, Microelectronics and nanometer structures
(literal)
- Http://www.cnr.it/ontology/cnr/pubblicazioni.owl#autori
- Giannazzo F., Priolo F., Raineri V., Privitera V., Picariello A., Battaglia A., Moffat S. (literal)
- Pagina inizio
- Pagina fine
- Http://www.cnr.it/ontology/cnr/pubblicazioni.owl#numeroVolume
- Rivista
- Http://www.cnr.it/ontology/cnr/pubblicazioni.owl#numeroFascicolo
- Note
- ISI Web of Science (WOS) (literal)
- Http://www.cnr.it/ontology/cnr/pubblicazioni.owl#affiliazioni
- CNR, IMETEM, I-95121 Catania, Italy
Catania Univ, Dipartimento Fis, I-95129 Catania, Italy
Appl Mat Inc, Catania, Italy
Appl Implant Technol Ltd, Appl Mat, Horsham, W Sussex, England (literal)
- Titolo
- Two-dimensional effects on ultralow energy B implants in Si (literal)
- Abstract
- A systematic work has been carried out in order to optimize sample
preparation and scanning capacitance microscopy (SCM) on double beveled
samples. The method allowed us to enhance depth and lateral resolution and
it has been applied to characterize two-dimensional profiles of ultralow
energy B implants in Si after diffusion. Implants have been performed into
patterned wafers with different stripe widths ranging from 0.5 to 5
microns. B transient enhanced diffusion is strongly reduced with decreasing
feature size below about 2 microns. This effect has been related to the
high interstitial diffusivity with respect to B. It is even enlarged for
lateral diffusion due to the interstitial recombination under the SiO2 mask
at the Si/SiO2 interface. The implications for the formation of
ultrashallow junctions in device structures are also discussed. (literal)
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