Surface and structural disorder in MBE and sputtering deposited Cu thin films revealed by X-ray measurements (Articolo in rivista)

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  • Surface and structural disorder in MBE and sputtering deposited Cu thin films revealed by X-ray measurements (Articolo in rivista) (literal)
Anno
  • 2008-01-01T00:00:00+01:00 (literal)
Alternative label
  • Salvato, M; Aurigemma, A; Tesauro, A; Attanasio, C (2008)
    Surface and structural disorder in MBE and sputtering deposited Cu thin films revealed by X-ray measurements
    in Vacuum
    (literal)
Http://www.cnr.it/ontology/cnr/pubblicazioni.owl#autori
  • Salvato, M; Aurigemma, A; Tesauro, A; Attanasio, C (literal)
Pagina inizio
  • 556 (literal)
Pagina fine
  • 560 (literal)
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  • 82 (literal)
Rivista
Note
  • ISI Web of Science (WOS) (literal)
Http://www.cnr.it/ontology/cnr/pubblicazioni.owl#affiliazioni
  • \"[Salvato, M.] Univ Roma Tor Vergata, Dipartimento Fis, I-00193 Rome, Italy; [Aurigemma, A.; Tesauro, A.; Attanasio, C.] Univ Salerno, Dipartimento Fis ER Caianiello, I-84081 Baronissi, SA, Italy; [Salvato, M.; Aurigemma, A.; Tesauro, A.; Attanasio, C.] CNR, INFM, Lab Reg SuperMat, I-84081 Baronissi, Italy (literal)
Titolo
  • Surface and structural disorder in MBE and sputtering deposited Cu thin films revealed by X-ray measurements (literal)
Abstract
  • Copper thin films have been deposited on Si substrates by molecular beam epitaxy (MBE) at different deposition rates varying from I up to 22 angstrom/s. X-ray reflectivity and theta-2 theta measurements have shown that the surface roughness correlation length, the structural disorder and the grain dimensions are strongly affected by the deposition rate. Comparing these results with those obtained for sputtered deposited thin films with a low deposition rate (2.5 angstrom/s), a clear similarity between the MBE samples deposited with the highest deposition rate and the sputtering Cu films is observed. This result has been interpreted considering the different energies of the particles that approach the substrate in the two deposition techniques. (c) 2007 Elsevier Ltd. All rights reserved. (literal)
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