http://www.cnr.it/ontology/cnr/individuo/prodotto/ID320297
Semiconductor Processing: Novel Hybrid Organic-Inorganic Spin-on Resist for Electron- or Photon-Based Nanolithography with Outstanding Resistance to Dry Etching (Adv. Mater. 43/2013). (Articolo in rivista)
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- Label
- Semiconductor Processing: Novel Hybrid Organic-Inorganic Spin-on Resist for Electron- or Photon-Based Nanolithography with Outstanding Resistance to Dry Etching (Adv. Mater. 43/2013). (Articolo in rivista) (literal)
- Anno
- 2013-01-01T00:00:00+01:00 (literal)
- Http://www.cnr.it/ontology/cnr/pubblicazioni.owl#doi
- 10.1002/adma.201370271 (literal)
- Alternative label
Zanchetta, Erika; Giustina, Gioia Della; Grenci, Gianluca; Pozzato, Alessandro; Tormen, Massimo; Brusatin, Giovanna (2013)
Semiconductor Processing: Novel Hybrid Organic-Inorganic Spin-on Resist for Electron- or Photon-Based Nanolithography with Outstanding Resistance to Dry Etching (Adv. Mater. 43/2013).
in Advanced materials (Weinh., Print)
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- Http://www.cnr.it/ontology/cnr/pubblicazioni.owl#autori
- Zanchetta, Erika; Giustina, Gioia Della; Grenci, Gianluca; Pozzato, Alessandro; Tormen, Massimo; Brusatin, Giovanna (literal)
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- ISI Web of Science (WOS) (literal)
- Http://www.cnr.it/ontology/cnr/pubblicazioni.owl#affiliazioni
- [Zanchetta, Erika; Della Giustina, Gioia; Brusatin, Giovanna] Dept Ind Engn, I-35131 Padua,
Italy; [Zanchetta, Erika; Della Giustina, Gioia; Brusatin, Giovanna] INSTM, I-35131 Padua,
Italy; [Grenci, Gianluca; Pozzato, Alessandro; Tormen, Massimo] CNR IOM, Lab TASC, LILIT
Beam Line, I-34149 Trieste, Italy (literal)
- Titolo
- Semiconductor Processing: Novel Hybrid Organic-Inorganic Spin-on Resist for Electron- or Photon-Based Nanolithography with Outstanding Resistance to Dry Etching (Adv. Mater. 43/2013). (literal)
- Abstract
- A new, unique spin-on metal-organic resist presenting a combination of worthwhile properties is described by Giovanna Brusatin and co-workers on page 6261. The resist shows good processability, typical of polymeric resists, direct patternability with various forms of radiation, mild post-exposure treatment requirements, positive or negative tone development, and a selectivity greater than 100:1 with respect to the underlying silicon in a fluorine-based continuous plasma-etching process. The use of such materials for high-resolution deep silicon etching is time- and cost-effective compared with the pattern-transfer materials that are generally used. (literal)
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