Semiconductor Processing: Novel Hybrid Organic-Inorganic Spin-on Resist for Electron- or Photon-Based Nanolithography with Outstanding Resistance to Dry Etching (Adv. Mater. 43/2013). (Articolo in rivista)

Type
Label
  • Semiconductor Processing: Novel Hybrid Organic-Inorganic Spin-on Resist for Electron- or Photon-Based Nanolithography with Outstanding Resistance to Dry Etching (Adv. Mater. 43/2013). (Articolo in rivista) (literal)
Anno
  • 2013-01-01T00:00:00+01:00 (literal)
Http://www.cnr.it/ontology/cnr/pubblicazioni.owl#doi
  • 10.1002/adma.201370271 (literal)
Alternative label
  • Zanchetta, Erika; Giustina, Gioia Della; Grenci, Gianluca; Pozzato, Alessandro; Tormen, Massimo; Brusatin, Giovanna (2013)
    Semiconductor Processing: Novel Hybrid Organic-Inorganic Spin-on Resist for Electron- or Photon-Based Nanolithography with Outstanding Resistance to Dry Etching (Adv. Mater. 43/2013).
    in Advanced materials (Weinh., Print)
    (literal)
Http://www.cnr.it/ontology/cnr/pubblicazioni.owl#autori
  • Zanchetta, Erika; Giustina, Gioia Della; Grenci, Gianluca; Pozzato, Alessandro; Tormen, Massimo; Brusatin, Giovanna (literal)
Pagina inizio
  • 6304 (literal)
Http://www.cnr.it/ontology/cnr/pubblicazioni.owl#numeroVolume
  • 25 (literal)
Rivista
Http://www.cnr.it/ontology/cnr/pubblicazioni.owl#numeroFascicolo
  • 43 (literal)
Note
  • ISI Web of Science (WOS) (literal)
Http://www.cnr.it/ontology/cnr/pubblicazioni.owl#affiliazioni
  • [Zanchetta, Erika; Della Giustina, Gioia; Brusatin, Giovanna] Dept Ind Engn, I-35131 Padua, Italy; [Zanchetta, Erika; Della Giustina, Gioia; Brusatin, Giovanna] INSTM, I-35131 Padua, Italy; [Grenci, Gianluca; Pozzato, Alessandro; Tormen, Massimo] CNR IOM, Lab TASC, LILIT Beam Line, I-34149 Trieste, Italy (literal)
Titolo
  • Semiconductor Processing: Novel Hybrid Organic-Inorganic Spin-on Resist for Electron- or Photon-Based Nanolithography with Outstanding Resistance to Dry Etching (Adv. Mater. 43/2013). (literal)
Abstract
  • A new, unique spin-on metal-organic resist presenting a combination of worthwhile properties is described by Giovanna Brusatin and co-workers on page 6261. The resist shows good processability, typical of polymeric resists, direct patternability with various forms of radiation, mild post-exposure treatment requirements, positive or negative tone development, and a selectivity greater than 100:1 with respect to the underlying silicon in a fluorine-based continuous plasma-etching process. The use of such materials for high-resolution deep silicon etching is time- and cost-effective compared with the pattern-transfer materials that are generally used. (literal)
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