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Electrical characterization and Auger depth profiling of nanogap electrodes fabricated by I-2-assisted focused ion beam (Articolo in rivista)
- Type
- Label
- Electrical characterization and Auger depth profiling of nanogap electrodes fabricated by I-2-assisted focused ion beam (Articolo in rivista) (literal)
- Anno
- 2006-01-01T00:00:00+01:00 (literal)
- Http://www.cnr.it/ontology/cnr/pubblicazioni.owl#doi
- 10.1063/1.2364833 (literal)
- Alternative label
Gazzadi, GC; Angeli, E; Facci, P; Frabboni, S (2006)
Electrical characterization and Auger depth profiling of nanogap electrodes fabricated by I-2-assisted focused ion beam
in Applied physics letters
(literal)
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- Gazzadi, GC; Angeli, E; Facci, P; Frabboni, S (literal)
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- INFM, CNR, I-41100 Modena, Italy; Univ Modena & Reggio Emilia, Dipartimento Fis, I-41100 Modena, Italy (literal)
- Titolo
- Electrical characterization and Auger depth profiling of nanogap electrodes fabricated by I-2-assisted focused ion beam (literal)
- Abstract
- Iodine (I-2)-assisted, 30 keV Ga+ focused ion beam (FIB) has been employed to fabricate nanogap Au electrodes and has been compared to conventional FIB milling. Electrical characterization shows that I-2 assistance improves insulation resistance from 300-400 G Omega to 20-50 T Omega. Auger depth profiling reveals that the Ga concentration profile in FIB-milled samples has a peak value of 25 at. % at 7 nm and extends, with a decreasing Gaussian tail, down to 40 nm, whereas in I-2-processed samples Ga concentration is reduced below 5 at. %. I-2 assistance is found to increase minimum gap size from 8 to 16 nm and to markedly roughen Au surface morphology. (c) 2006 American Institute of Physics. (literal)
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