High-resolution strain sensing on steel by Silicon-On-Insulator flexural resonators fabricated with chip-level vacuum packaging (Contributo in atti di convegno)

Type

• Contributo in atti di convegno (Classe)
• Prodotto della ricerca (Classe)

Label

• High-resolution strain sensing on steel by Silicon-On-Insulator flexural resonators fabricated with chip-level vacuum packaging (Contributo in atti di convegno) (literal)

Anno

• 2013-01-01T00:00:00+01:00 (literal)

Http://www.cnr.it/ontology/cnr/pubblicazioni.owl#doi

• 10.1109/Transducers.2013.6626936 (literal)

Alternative label

• Belsito, L. and Ferri, M. and Mancarella, F. and Roncaglia, A. and Yan, J. and Seshia, A.A. and Soga, K. (2013)
  High-resolution strain sensing on steel by Silicon-On-Insulator flexural resonators fabricated with chip-level vacuum packaging
  in 17th International Conference on Solid-State Sensors, Actuators and Microsystems, TRANSDUCERS and EUROSENSORS 2013
  (literal)

Http://www.cnr.it/ontology/cnr/pubblicazioni.owl#autori

• Belsito, L. and Ferri, M. and Mancarella, F. and Roncaglia, A. and Yan, J. and Seshia, A.A. and Soga, K. (literal)

Pagina inizio

• 992 (literal)

Pagina fine

• 995 (literal)

Http://www.cnr.it/ontology/cnr/pubblicazioni.owl#altreInformazioni

• cited By 0; Conference of 2013 17th International Conference on Solid-State Sensors, Actuators and Microsystems, TRANSDUCERS and EUROSENSORS 2013 ; Conference Date: 16 June 2013 Through 20 June 2013; Conference Code:101747 (literal)

Http://www.cnr.it/ontology/cnr/pubblicazioni.owl#url

• http://www.scopus.com/inward/record.url?eid=2-s2.0-84891697440&partnerID=40&md5=06fe8ba0bab6b2770d9accd8518292ad (literal)

Note

• Scopu (literal)

Http://www.cnr.it/ontology/cnr/pubblicazioni.owl#affiliazioni

• Institute of Microelectronics and Microsystems, CNR, Bologna, Italy; Department of Engineering, University of Cambridge, Cambridge, United Kingdom (literal)

Titolo

• High-resolution strain sensing on steel by Silicon-On-Insulator flexural resonators fabricated with chip-level vacuum packaging (literal)

Http://www.cnr.it/ontology/cnr/pubblicazioni.owl#isbn

• 9781467359818 (literal)

Abstract

• This paper reports on the fabrication and characterization of high-resolution strain sensors for steel based on Silicon On Insulator flexural resonators manufactured with chip-level LPCVD vacuum packaging. The sensors present high sensitivity (120 Hz/?), very high resolution (4 n), low drift, and near-perfect reversibility in bending tests performed in both tensile and compressive strain regimes. (literal)

Prodotto di

• Institute for microelectronics and microsystems (IMM) (Istituto)

Autore CNR

• ALBERTO RONCAGLIA (Persona)
• FULVIO MANCARELLA (Unità di personale interno)
• LUCA BELSITO (Persona)
• MATTEO FERRI (Unità di personale esterno)

Insieme di parole chiave

• Parole chiave di "High-resolution strain sensing on steel by Silicon-On-Insulator flexural resonators fabricated with chip-level vacuum packaging" (Insieme di parole chiave)

Incoming links:

Prodotto

• Institute for microelectronics and microsystems (IMM) (Istituto)

Autore CNR di

• MATTEO FERRI (Unità di personale esterno)
• ALBERTO RONCAGLIA (Persona)
• LUCA BELSITO (Persona)
• FULVIO MANCARELLA (Unità di personale interno)

Insieme di parole chiave di

• Parole chiave di "High-resolution strain sensing on steel by Silicon-On-Insulator flexural resonators fabricated with chip-level vacuum packaging" (Insieme di parole chiave)