MESFETs on H-terminated polycrystalline diamond (Contributo in atti di convegno)

Type
Label
  • MESFETs on H-terminated polycrystalline diamond (Contributo in atti di convegno) (literal)
Anno
  • 2009-01-01T00:00:00+01:00 (literal)
Alternative label
  • P. Calvani (1), F. Sinisi (1), M.C. Rossi (1), G. Conte (1), E. Giovine (2), W. Ciccognani (3), E. Limiti (3) (2009)
    MESFETs on H-terminated polycrystalline diamond
    in 10th International Conference on Ultimate Integration on Silicon, Aachen, GERMANY, MAR 18-20, 2009
    (literal)
Http://www.cnr.it/ontology/cnr/pubblicazioni.owl#autori
  • P. Calvani (1), F. Sinisi (1), M.C. Rossi (1), G. Conte (1), E. Giovine (2), W. Ciccognani (3), E. Limiti (3) (literal)
Pagina inizio
  • 257 (literal)
Pagina fine
  • 260 (literal)
Http://www.cnr.it/ontology/cnr/pubblicazioni.owl#titoloVolume
  • ULIS 2009: 10TH INTERNATIONAL CONFERENCE ON ULTIMATE INTEGRATION OF SILICON (literal)
Note
  • ISI Web of Science (WOS) (literal)
Http://www.cnr.it/ontology/cnr/pubblicazioni.owl#affiliazioni
  • 1. Univ Roma Tre, Dept Elect Engn, Via Vasca Navale 8, I-00146 Rome, Italy 2. 3. (literal)
Titolo
  • MESFETs on H-terminated polycrystalline diamond (literal)
Http://www.cnr.it/ontology/cnr/pubblicazioni.owl#isbn
  • 978-1-4244-3705-4 (literal)
Http://www.cnr.it/ontology/cnr/pubblicazioni.owl#autoriVolume
  • Mantl, S; Lemme, M; Schubert, J; Albrecht, W (literal)
Abstract
  • Metal-Semiconductor Field Effect Transistors (MESFETs) were fabricated on polycrystalline diamond. Devices were realized to be employed in Microwave Integrated Circuits for satellite communications and high frequency power amplification, areas were diamond promise the replacement of vacuum electronics. Fabricated MESFETs typically showed high drain-source current (140 ma/mm) and large transconductance values (50 ms/mm), with a cut off frequency f(t)=10 GHz and a maximum oscillation frequency, f(max), up to 35 GHz. These values suggest device microwave operation and are obtained through the fabrication of devices with geometry and active region dimensions (200-500 nm gate length) compatible with available microelectronic technologies. (literal)
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