Microwave operation of sub-micrometer gate surface channel MESFETs in polycystalline diamond (Articolo in rivista)

Type
Label
  • Microwave operation of sub-micrometer gate surface channel MESFETs in polycystalline diamond (Articolo in rivista) (literal)
Anno
  • 2009-01-01T00:00:00+01:00 (literal)
Http://www.cnr.it/ontology/cnr/pubblicazioni.owl#doi
  • 10.1002/mop.24738 (literal)
Alternative label
  • P. Calvani 1; A. Corsaro 1; F. Sinisi 1; M.C. Rossi 1; G. Conte 1; E. Giovine 2; W. Ciccognani 3; E. Limiti 3 (2009)
    Microwave operation of sub-micrometer gate surface channel MESFETs in polycystalline diamond
    in Microwave and optical technology letters (Print); John Wiley & Sons Inc., Hoboken (Stati Uniti d'America)
    (literal)
Http://www.cnr.it/ontology/cnr/pubblicazioni.owl#autori
  • P. Calvani 1; A. Corsaro 1; F. Sinisi 1; M.C. Rossi 1; G. Conte 1; E. Giovine 2; W. Ciccognani 3; E. Limiti 3 (literal)
Pagina inizio
  • 2786 (literal)
Pagina fine
  • 2788 (literal)
Http://www.cnr.it/ontology/cnr/pubblicazioni.owl#numeroVolume
  • 51 (literal)
Rivista
Http://www.cnr.it/ontology/cnr/pubblicazioni.owl#pagineTotali
  • 3 (literal)
Http://www.cnr.it/ontology/cnr/pubblicazioni.owl#numeroFascicolo
  • 11 (literal)
Note
  • ISI Web of Science (WOS) (literal)
Http://www.cnr.it/ontology/cnr/pubblicazioni.owl#affiliazioni
  • 1. Univ Roma Tre, Dept Elect Engn, I-00146 Rome, Italy 2. CNR, Ist Foton & Nanotecnol, Rome, Italy 3. Univ Roma Tor Vergata, Dept Elect Engn, I-00133 Rome, Italy (literal)
Titolo
  • Microwave operation of sub-micrometer gate surface channel MESFETs in polycystalline diamond (literal)
Abstract
  • Submicron gate-length metal semiconductor field effect transistors (MESFETs) were fabricated on hydrogen-terminated-large grain polycrystalline diamond. Devices showed high drain-source current (140 ma/mm) and large transconductance values (50 ms/mm), with a cut-off frequency f(r) = 10 GHz and a maximum oscillation frequency, f(max) up to 35 GHz. These values are obtained through the fabrication of devices with geometry and active region dimensions (200-500 nm gate length) compatible with available microelectronic technologies. (literal)
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