Building CMUTs for imaging applications from top to bottom (Articolo in rivista)

Type
Label
  • Building CMUTs for imaging applications from top to bottom (Articolo in rivista) (literal)
Anno
  • 2007-01-01T00:00:00+01:00 (literal)
Http://www.cnr.it/ontology/cnr/pubblicazioni.owl#doi
  • 10.1016/j.mee.2007.01.211 (literal)
Alternative label
  • A. Coppa; E. Cianci; V. Foglietti; G. Caliano; M. Pappalardo (2007)
    Building CMUTs for imaging applications from top to bottom
    in Microelectronic engineering
    (literal)
Http://www.cnr.it/ontology/cnr/pubblicazioni.owl#autori
  • A. Coppa; E. Cianci; V. Foglietti; G. Caliano; M. Pappalardo (literal)
Pagina inizio
  • 1312 (literal)
Pagina fine
  • 1315 (literal)
Http://www.cnr.it/ontology/cnr/pubblicazioni.owl#numeroVolume
  • 84 (literal)
Rivista
Note
  • ISI Web of Science (WOS) (literal)
Http://www.cnr.it/ontology/cnr/pubblicazioni.owl#affiliazioni
  • IFN-Istituto di Fotonica e Nanotecnologie, Via CinetoRomano 42 00156 Roma Universit√† di Roma ROMATRE Dipartimento di Ingegneria Elettronica Via della Vasca Navale 00146 Roma (literal)
Titolo
  • Building CMUTs for imaging applications from top to bottom (literal)
Abstract
  • This paper focuses on an innovative fabrication process of a capacitive micromachined ultrasonic transducer (CMUT) array for medical imaging. Our approach consists in inverting the function of each layer to build the CMUT capacitive cell starting from the membrane, made of silicon nitride, up to the bottom electrode, which is supported by an appropriate acoustic backing to absorb any ultrasound energy transmitted towards the backside of the array and to prevent the ringing of the pulse-echo signal. The fabricated devices exhibited a large bandwidth (>100%) and an increased sensitivity, in respect to the classical CMUT devices. Using the fabricated devices as linear probes, echographic images are obtained. (literal)
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