Wetting behaviour of ternary Au-Ge-X (X = Sb, Sn) alloys on Cu and Ni (Articolo in rivista)

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  • Wetting behaviour of ternary Au-Ge-X (X = Sb, Sn) alloys on Cu and Ni (Articolo in rivista) (literal)
Anno
  • 2013-01-01T00:00:00+01:00 (literal)
Http://www.cnr.it/ontology/cnr/pubblicazioni.owl#doi
  • 10.1007/s11664-013-2497-z (literal)
Alternative label
  • Jin S.; Valenza F.; Novakovic R.; Leinenbach C. (2013)
    Wetting behaviour of ternary Au-Ge-X (X = Sb, Sn) alloys on Cu and Ni
    in Journal of electronic materials; Springer, New York (Stati Uniti d'America)
    (literal)
Http://www.cnr.it/ontology/cnr/pubblicazioni.owl#autori
  • Jin S.; Valenza F.; Novakovic R.; Leinenbach C. (literal)
Pagina inizio
  • 1024 (literal)
Pagina fine
  • 1032 (literal)
Http://www.cnr.it/ontology/cnr/pubblicazioni.owl#url
  • http://link.springer.com/article/10.1007/s11664-013-2497-z (literal)
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  • 42 (literal)
Rivista
Http://www.cnr.it/ontology/cnr/pubblicazioni.owl#pagineTotali
  • 9 (literal)
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  • 6 (literal)
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  • ISI Web of Science (WOS) (literal)
  • Scopu (literal)
Http://www.cnr.it/ontology/cnr/pubblicazioni.owl#affiliazioni
  • 1,4 : Empa-Swiss Federal Laboratories for Materials Science and Technology, Laboratory for Joining Technologies and Corrosion, Überlandstrasse 129, 8600 Dübendorf, Switzerland / 1 : Computational Materials Laboratory, Ecole Polytechnique Fédérale de Lausanne, Station 12, 1015 Lausanne, Switzerland / 2,3 : National Research Council (CNR), Institute for Energetics and Interphases (IENI), 16149 Genoa, Italy (literal)
Titolo
  • Wetting behaviour of ternary Au-Ge-X (X = Sb, Sn) alloys on Cu and Ni (literal)
Abstract
  • Au-Ge-based alloys are potential substitutes for Pb-rich solders currently used for high-temperature applications. In the present work, the wetting behavior of two Au-Ge-X (X = Sb, Sn) ternary alloys, i.e., Au-15Ge-17Sb and Au-13.7 Ge-15.3Sn (at.%), in contact with Cu and Ni substrates has been investigated. Au-13.7Ge-15.3Sn alloy showed complete wetting on both Cu and Ni substrates. Total spreading of Au-15Ge-17Sb alloy on Cu was also observed, while the final contact angle of this alloy on Ni was about 29°. Pronounced dissolution of Cu substrates into the solder alloys investigated was detected, while the formation of Ni-Ge intermetallic compounds at the interface of both solder/Ni systems suppressed the dissolution of Ni into the solder. (literal)
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