Fabrication of bulk and epitaxial germanium field emitter arrays by dry etching techniques (Articolo in rivista)

Type
Label
  • Fabrication of bulk and epitaxial germanium field emitter arrays by dry etching techniques (Articolo in rivista) (literal)
Anno
  • 2013-01-01T00:00:00+01:00 (literal)
Http://www.cnr.it/ontology/cnr/pubblicazioni.owl#doi
  • 10.1016/j.mee.2012.11.024 (literal)
Alternative label
  • S. Carta 1 , R. Bagni 2, E. Giovine 1, V Foglietti 1, F. Evangelisti 2, A. Notargiacomo 1 (2013)
    Fabrication of bulk and epitaxial germanium field emitter arrays by dry etching techniques
    in Microelectronic engineering
    (literal)
Http://www.cnr.it/ontology/cnr/pubblicazioni.owl#autori
  • S. Carta 1 , R. Bagni 2, E. Giovine 1, V Foglietti 1, F. Evangelisti 2, A. Notargiacomo 1 (literal)
Pagina inizio
  • 230 (literal)
Pagina fine
  • 233 (literal)
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  • http://dx.doi.org/10.1016/j.mee.2012.11.024 (literal)
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  • Volume 110 (literal)
Rivista
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  • 4 (literal)
Note
  • Scopu (literal)
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  • 1 CNR - Institute for Photonics and Nanotechnology, Via Cineto Romano 42, 00156 Rome, Italy 2 Physics Department \"E. Amaldi\", Università degli Studi Roma TRE,Via della Vasca Navale 84, 00146 Rome, Italy (literal)
Titolo
  • Fabrication of bulk and epitaxial germanium field emitter arrays by dry etching techniques (literal)
Abstract
  • We present the fabrication and characterization of novel high density field emitter arrays (FEAs) on CVD-grown epitaxial germanium on (0 0 1) silicon. In particular we propose a heterostructure made up of silicon as substrate and of germanium as active layer, exploiting the infrared transparency of Si and the infrared sensitivity of Ge to realize a semi-transparent photo-assisted electron beam source. We used a completely dry etching process in fluorinated gases (SF6) due to its significant under-etching for both silicon and germanium. High aspect ratio silicon and germanium FEAs, with minimum tip radii of 25 nm and 40 nm, respectively, and lower aspect ratio Ge/Si FEAs with minimum tip radii of 50 nm were fabricated. The realized FEAs show good emission behavior with field emission characteristics straight related to tip geometry: low electric field threshold for silicon and germanium tips (<18 V/?m) and enhancement factor of more than 250 and 130, respectively; conversely for the epitaxial germanium we obtained 32 V/?m for electric field threshold and 70 for enhancement factor. Current emission time stability for silicon, for germanium and for Ge/Si field emitter arrays were demonstrated. (literal)
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