Wetting behaviour of lead-free Sn-based alloys on Cu and Ni substrates (Articolo in rivista)

Type

• Articolo in rivista (Classe)
• Prodotto della ricerca (Classe)

Label

• Wetting behaviour of lead-free Sn-based alloys on Cu and Ni substrates (Articolo in rivista) (literal)

Anno

• 2008-01-01T00:00:00+01:00 (literal)

Http://www.cnr.it/ontology/cnr/pubblicazioni.owl#doi

• 10.1016/j.msea.2007.10.110 (literal)

Alternative label

• S. Amore; E. Ricci; G. Borzone; Novakovic R. (2008)
  Wetting behaviour of lead-free Sn-based alloys on Cu and Ni substrates
  in Materials science & engineering. A, Structural materials: properties, microstructure and processing
  (literal)

Http://www.cnr.it/ontology/cnr/pubblicazioni.owl#autori

• S. Amore; E. Ricci; G. Borzone; Novakovic R. (literal)

Pagina inizio

• 108 (literal)

Pagina fine

• 112 (literal)

Http://www.cnr.it/ontology/cnr/pubblicazioni.owl#numeroVolume

• 495 (literal)

Rivista

• Materials science & engineering. A, Structural materials: properties, microstructure and processing (Rivista)

Http://www.cnr.it/ontology/cnr/pubblicazioni.owl#numeroFascicolo

• 1-2 (literal)

Note

• ISI Web of Science (WOS) (literal)
• Scopu (literal)

Http://www.cnr.it/ontology/cnr/pubblicazioni.owl#affiliazioni

• CNR-IENI, Via de Marini 6, 16149 Genoa, Italy; DCCI-University of Genoa, Via Dodecaneso 31, 16146 Genoa, Italy (literal)

Titolo

• Wetting behaviour of lead-free Sn-based alloys on Cu and Ni substrates (literal)

Abstract

• The present work was carried out in the framework of the study of new lead-free solder alloys for technical applications in electronic devices. In the focus of this characterisation the wetting behaviour of several Sn-rich alloys belonging to the In-Sn, Au-Sn and Cu-Sn systems has been studied by measuring the contact angle variations on Cu and Ni substrates as a function of time and temperature. The interface between the alloy and the substrate has been analysed by the use of optical microscopy and scanning electron microscopy combined with energy-dispersive X-ray spectrometry in order to study the reaction between the alloy and the solid substrate and the possible formation of different compounds at the interface. A remarkable effect of the two different substrates on the behaviour of the contact angle as a function of temperature and on the morphology of the interface between the liquid solder and the solid substrate was observed for the In-Sn and Cu-Sn, while the Au-Sn system shows a very similar wetting behaviour on Cu and Ni. (literal)

Prodotto di

• Institute of Condensed Matter Chemistry and Energy Technologies (ICMATE) (Istituto)
• Progettazione chimico fisica di interfacce in sistemi metallici e metallo-ceramici (ET.P06.006.001) (Modulo)

Autore CNR

• STEFANO AMORE (Unità di personale esterno)
• RADA NOVAKOVIC (Unità di personale interno)
• ENRICA RICCI (Persona)

Insieme di parole chiave

• Parole chiave di "Wetting behaviour of lead-free Sn-based alloys on Cu and Ni substrates" (Insieme di parole chiave)

Incoming links:

Autore CNR di

• ENRICA RICCI (Persona)
• RADA NOVAKOVIC (Unità di personale interno)
• STEFANO AMORE (Unità di personale esterno)

Prodotto

• Institute of Condensed Matter Chemistry and Energy Technologies (ICMATE) (Istituto)
• Progettazione chimico fisica di interfacce in sistemi metallici e metallo-ceramici (ET.P06.006.001) (Modulo)

Http://www.cnr.it/ontology/cnr/pubblicazioni.owl#rivistaDi

• Materials science & engineering. A, Structural materials: properties, microstructure and processing (Rivista)

Insieme di parole chiave di

• Parole chiave di "Wetting behaviour of lead-free Sn-based alloys on Cu and Ni substrates" (Insieme di parole chiave)