Use of the Bending-Beam-Method for the Study of the Anodic Oxidation of Silicon in Dilute Fluoride Media (Articolo in rivista)

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Label
  • Use of the Bending-Beam-Method for the Study of the Anodic Oxidation of Silicon in Dilute Fluoride Media (Articolo in rivista) (literal)
Anno
  • 2000-01-01T00:00:00+01:00 (literal)
Http://www.cnr.it/ontology/cnr/pubblicazioni.owl#doi
  • 10.1016/S0013-4686(00)00612-5 (literal)
Alternative label
  • Decker F.; Pantano E.; Dini D.; Cattarin S.; Maffi S.; Razzini G. (2000)
    Use of the Bending-Beam-Method for the Study of the Anodic Oxidation of Silicon in Dilute Fluoride Media
    in Electrochimica acta
    (literal)
Http://www.cnr.it/ontology/cnr/pubblicazioni.owl#autori
  • Decker F.; Pantano E.; Dini D.; Cattarin S.; Maffi S.; Razzini G. (literal)
Pagina inizio
  • 4607 (literal)
Pagina fine
  • 4613 (literal)
Http://www.cnr.it/ontology/cnr/pubblicazioni.owl#url
  • http://www.sciencedirect.com/science/article/pii/S0013468600006125 (literal)
Http://www.cnr.it/ontology/cnr/pubblicazioni.owl#numeroVolume
  • 45 (literal)
Rivista
Http://www.cnr.it/ontology/cnr/pubblicazioni.owl#pagineTotali
  • 7 (literal)
Http://www.cnr.it/ontology/cnr/pubblicazioni.owl#numeroFascicolo
  • 28 (literal)
Note
  • ISI Web of Science (WOS) (literal)
  • Scopu (literal)
Http://www.cnr.it/ontology/cnr/pubblicazioni.owl#affiliazioni
  • 1,2 : Dipartimento di Chimica, Univ.' Roma 'La Sapienza', P., Rome, Italy / 3 : Abt. Phys. Chemie, Fritz-Haber-Inst. Max-Planck-G., Berlin, Germany / 4 : Ist. Polarografia Ed E., CNR, Padua, 35132, Padua, Italy / 5,6 : Dipto. di Chimica-Fisica Applicata, Politecnico di Milano, 20131, Milan, Italy (literal)
Titolo
  • Use of the Bending-Beam-Method for the Study of the Anodic Oxidation of Silicon in Dilute Fluoride Media (literal)
Abstract
  • The chemical dissolution of anodically grown Si oxides in acidic fluoride medium has been studied in-situ with the Bending Beam Method (BBM). Current and deflection transients were recorded after switching the electrode from the given polarization conditions to zero applied field and monitoring the etchback process. Oxide stress values estimated with this approach are free from contributions due to film electrostriction and to changes in surface tension. Transients recorded after polarization in the regime of current or potential oscillations show dissolution patterns which contain information on the properties of oxide film along its depth profile. (literal)
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