Effect of copper on the localized corrosion resistance of Ni-Ti shape memory alloy (Articolo in rivista)

Type
Label
  • Effect of copper on the localized corrosion resistance of Ni-Ti shape memory alloy (Articolo in rivista) (literal)
Anno
  • 2002-01-01T00:00:00+01:00 (literal)
Alternative label
  • Rondelli G., Vicentini B. (2002)
    Effect of copper on the localized corrosion resistance of Ni-Ti shape memory alloy
    in Biomaterials
    (literal)
Http://www.cnr.it/ontology/cnr/pubblicazioni.owl#autori
  • Rondelli G., Vicentini B. (literal)
Pagina inizio
  • 639 (literal)
Pagina fine
  • 644 (literal)
Http://www.cnr.it/ontology/cnr/pubblicazioni.owl#numeroVolume
  • 23 (literal)
Rivista
Note
  • ISI Web of Science (WOS) (literal)
Titolo
  • Effect of copper on the localized corrosion resistance of Ni-Ti shape memory alloy (literal)
Abstract
  • An electrochemical study aiming at the evaluation of corrosion parameters using potentiodynamic and potentiostatic techniques (\"scratch\" and modified ASTM F746) was conducted in 0.9% NACl on wires from equiatomic Ni- Ti and ternary Ni44Ti51Cu5 superelastic alloys with Ti90Mol0 as a reference material. The results obtained using potentiostatic tests, that simulate better the behavior of material in service conditions than potentiodynamic ones, indicate that both Ni-Ti and Ni-Ti-Cu wires exhibit low corrosion potentials ( 50-150 mV versus SCE) inferior to that of Ti- Mo alloy. The latter proved to be immune to localized corrosion attacks up to 800mV. Key words: Ni-Ti-Cu alloy; Localized corrosion tests; Passive film; Martensitic transformation (literal)
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