Cost efficient master fabrication process on copper substrates (Articolo in rivista)

Type

• Prodotto della ricerca (Classe)
• Articolo in rivista (Classe)

Label

• Cost efficient master fabrication process on copper substrates (Articolo in rivista) (literal)

Anno

• 2011-01-01T00:00:00+01:00 (literal)

Http://www.cnr.it/ontology/cnr/pubblicazioni.owl#doi

• 10.1016/j.mee.2011.02.023 (literal)

Alternative label

• Marasso, Simone Luigi 1, Canavese, Giancarlo 2, Cocuzza, Matteo 3 (2011)
  Cost efficient master fabrication process on copper substrates
  in Microelectronic engineering; ELSEVIER SCIENCE BV, PO BOX 211, 1000 AE AMSTERDAM, NETHERLANDS, AMSTERDAM (Paesi Bassi)
  (literal)

Http://www.cnr.it/ontology/cnr/pubblicazioni.owl#autori

• Marasso, Simone Luigi 1, Canavese, Giancarlo 2, Cocuzza, Matteo 3 (literal)

Pagina inizio

• 2322 (literal)

Pagina fine

• 2324 (literal)

Http://www.cnr.it/ontology/cnr/pubblicazioni.owl#altreInformazioni

• ID_PUMA: cnr.imem/2011-A0-021 (literal)

Http://www.cnr.it/ontology/cnr/pubblicazioni.owl#url

• http://www.sciencedirect.com/science/article/pii/S0167931711001316 (literal)

Http://www.cnr.it/ontology/cnr/pubblicazioni.owl#numeroVolume

• 88 (literal)

Rivista

• Microelectronic engineering (Rivista)

Http://www.cnr.it/ontology/cnr/pubblicazioni.owl#pagineTotali

• 3 (literal)

Http://www.cnr.it/ontology/cnr/pubblicazioni.owl#numeroFascicolo

• 8 (literal)

Note

• ISI Web of Science (WOS) (literal)

Http://www.cnr.it/ontology/cnr/pubblicazioni.owl#affiliazioni

• [ 1 ] Politecn Torino, Latemar Unit, Dept Mat Sci & Chem Engn, Xlab Mat & Microsyst Lab, I-10034 Turin, Italy [ 2 ] Ist Italiano Tecnol, Ctr Space Human Robot, Turin, Italy [ 3 ] CNR IMEM, I-43124 Parma, Italy (literal)

Titolo

• Cost efficient master fabrication process on copper substrates (literal)

Abstract

• In this work a rapid and low cost process for master fabrication was carried out. Thick epoxy SU-8 photoresist was employed as sacrificial patternable layer for the definition of metal deposition area. An SU-8 photolithographic recipe was employed on low cost copper substrates, without the use of a seed layer. In particular an improvement of SU-8 adhesion, for structures with 7:1 aspect ratio, was obtained. This process was characterized by Field Emission Scanning Electron Microscope analysis on metallic substrates and it was compared with other UV-LIthographie Galvanoformung Abformung processes. An electrolytic Cu deposition was used to fabricate the master and, since the metal was deposited directly onto the copper substrate, the simplified LIGA-like process did not require silicon substrate removal or mechanical polishing. Hence, the fabrication steps and process time were considerably decreased. Finally, different molds with microfluidic patterns for hot embossing replication were obtained in 24 h with a significant costs reduction. (literal)

Editore

• ELSEVIER SCIENCE BV, PO BOX 211, 1000 AE AMSTERDAM, NETHERLANDS (Editore)

Prodotto di

• Nanostrutture e dispositivi da SuMBE per sensoristica e fotovoltaico: sviluppo e caratterizzazione (SP.P02.001.004) (Modulo)
• Istituto dei materiali per l'elettronica ed il magnetismo (IMEM) (Istituto)

Autore CNR

• MATTEO COCUZZA (Unità di personale interno)

Insieme di parole chiave

• Keywords of "Cost efficient master fabrication process on copper substrates" (Insieme di parole chiave)

Incoming links:

Prodotto

• Istituto dei materiali per l'elettronica ed il magnetismo (IMEM) (Istituto)
• Nanostrutture e dispositivi da SuMBE per sensoristica e fotovoltaico: sviluppo e caratterizzazione (SP.P02.001.004) (Modulo)

Autore CNR di

• MATTEO COCUZZA (Unità di personale interno)

Http://www.cnr.it/ontology/cnr/pubblicazioni.owl#rivistaDi

• Microelectronic engineering (Rivista)

Editore di

• ELSEVIER SCIENCE BV, PO BOX 211, 1000 AE AMSTERDAM, NETHERLANDS (Editore)

Insieme di parole chiave di

• Keywords of "Cost efficient master fabrication process on copper substrates" (Insieme di parole chiave)