Submicron YBa2Cu3O7-x bicrystal grain boundary junctions by Focused Ion Beam (Articolo in rivista)

Type
Label
  • Submicron YBa2Cu3O7-x bicrystal grain boundary junctions by Focused Ion Beam (Articolo in rivista) (literal)
Anno
  • 2004-01-01T00:00:00+01:00 (literal)
Http://www.cnr.it/ontology/cnr/pubblicazioni.owl#doi
  • 10.1088/0953-2048/17/2/009 (literal)
Alternative label
  • G Testa1, AMonaco1, E Sarnelli1, A D'Agostino2, D-JKang3,4, E J Tarte3, SHMennema3, C Bell3 and M G Blamire3 (2004)
    Submicron YBa2Cu3O7-x bicrystal grain boundary junctions by Focused Ion Beam
    in Superconductor science and technology (Print)
    (literal)
Http://www.cnr.it/ontology/cnr/pubblicazioni.owl#autori
  • G Testa1, AMonaco1, E Sarnelli1, A D'Agostino2, D-JKang3,4, E J Tarte3, SHMennema3, C Bell3 and M G Blamire3 (literal)
Pagina inizio
  • 287 (literal)
Pagina fine
  • 290 (literal)
Http://www.cnr.it/ontology/cnr/pubblicazioni.owl#numeroVolume
  • 17 (literal)
Rivista
Http://www.cnr.it/ontology/cnr/pubblicazioni.owl#pagineTotali
  • 4 (literal)
Note
  • ISI Web of Science (WOS) (literal)
Http://www.cnr.it/ontology/cnr/pubblicazioni.owl#affiliazioni
  • 1 Istituto di Cibernetica 'E Caianiello' del CNR, 80078 Pozzuoli (Naples), Italy 2 Promete S. r. l., INFM Spin Off Company, 80124 Naples, Italy 3 Department of Materials Science, University of Cambridge, Cambridge CB2 3QZ, UK 4 Nanoscience Centre, IRC in Nanotechnology, University of Cambridge, Cambridge CB3 0FF, UK (literal)
Titolo
  • Submicron YBa2Cu3O7-x bicrystal grain boundary junctions by Focused Ion Beam (literal)
Abstract
  • Submicron YBa2Cu3O7-x bicrystal grain boundary junctions have been fabricated, for the first time, by a focused ion beam process. Although such a process has always been considered detrimental to the YBa2Cu3O7-x because of gallium contamination, high quality 24degrees [001] tilt junctions characterized by RSJ current-voltage characteristics, ICRN products of the order of 1-4 x 10(4) A cm(-2) at 77 K and Fraunhofer-like modulation patterns have been obtained. No significant degradation has been observed over more than 3 months. The critical current density J(C) and the characteristic voltage ICRN show a clear maximum for widths of the order of the Josephson penetration depth. The asymptotic normal resistance shows a typical (width)(-1) dependence, indicating that the FIB process does not increase the grain boundary resistivity of submicron junctions. Experimental results clearly show that FIB is a very powerful tool for the fabrication of high critical temperature superconducting circuits, requiring a small number of submicron Josephson junctions, and for fundamental physics analysis. it also allow the final turning or repair of superconducting or more complex integrated superconducting-semiconducting devices. (literal)
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