http://www.cnr.it/ontology/cnr/individuo/prodotto/ID18889
Submicron YBa2Cu3O7-x bicrystal grain boundary junctions by Focused Ion Beam (Articolo in rivista)
- Type
- Label
- Submicron YBa2Cu3O7-x bicrystal grain boundary junctions by Focused Ion Beam (Articolo in rivista) (literal)
- Anno
- 2004-01-01T00:00:00+01:00 (literal)
- Http://www.cnr.it/ontology/cnr/pubblicazioni.owl#doi
- 10.1088/0953-2048/17/2/009 (literal)
- Alternative label
G Testa1, AMonaco1, E Sarnelli1, A D'Agostino2, D-JKang3,4,
E J Tarte3, SHMennema3, C Bell3 and M G Blamire3 (2004)
Submicron YBa2Cu3O7-x bicrystal grain boundary junctions by Focused Ion Beam
in Superconductor science and technology (Print)
(literal)
- Http://www.cnr.it/ontology/cnr/pubblicazioni.owl#autori
- G Testa1, AMonaco1, E Sarnelli1, A D'Agostino2, D-JKang3,4,
E J Tarte3, SHMennema3, C Bell3 and M G Blamire3 (literal)
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- Pagina fine
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- Rivista
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- Note
- ISI Web of Science (WOS) (literal)
- Http://www.cnr.it/ontology/cnr/pubblicazioni.owl#affiliazioni
- 1 Istituto di Cibernetica 'E Caianiello' del CNR, 80078 Pozzuoli (Naples), Italy
2 Promete S. r. l., INFM Spin Off Company, 80124 Naples, Italy
3 Department of Materials Science, University of Cambridge, Cambridge CB2 3QZ, UK
4 Nanoscience Centre, IRC in Nanotechnology, University of Cambridge, Cambridge CB3 0FF, UK (literal)
- Titolo
- Submicron YBa2Cu3O7-x bicrystal grain boundary junctions by Focused Ion Beam (literal)
- Abstract
- Submicron YBa2Cu3O7-x bicrystal grain boundary junctions have been fabricated, for the first time, by a focused ion beam process. Although such a process has always been considered detrimental to the YBa2Cu3O7-x because of gallium contamination, high quality 24degrees [001] tilt junctions characterized by RSJ current-voltage characteristics, ICRN products of the order of 1-4 x 10(4) A cm(-2) at 77 K and Fraunhofer-like modulation patterns have been obtained. No significant degradation has been observed over more than 3 months.
The critical current density J(C) and the characteristic voltage ICRN show a clear maximum for widths of the order of the Josephson penetration depth. The asymptotic normal resistance shows a typical (width)(-1) dependence, indicating that the FIB process does not increase the grain boundary resistivity of submicron junctions.
Experimental results clearly show that FIB is a very powerful tool for the fabrication of high critical temperature superconducting circuits, requiring a small number of submicron Josephson junctions, and for fundamental physics analysis. it also allow the final turning or repair of superconducting or more complex integrated superconducting-semiconducting devices. (literal)
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- Autore CNR
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