Polyethersulfone-epoxy terminated materials as thermosetting resins for microelectronic devices (Articolo in rivista)

Type

• Articolo in rivista (Classe)
• Prodotto della ricerca (Classe)

Label

• Polyethersulfone-epoxy terminated materials as thermosetting resins for microelectronic devices (Articolo in rivista) (literal)

Anno

• 2009-01-01T00:00:00+01:00 (literal)

Http://www.cnr.it/ontology/cnr/pubblicazioni.owl#doi

• 10.1002/pola.23611 (literal)

Alternative label

• E.Scamporrino, P.Mineo, A.Scamporrino, S.Dattilo, D.Vitalini, R.Alicata (2009)
  Polyethersulfone-epoxy terminated materials as thermosetting resins for microelectronic devices
  in Journal of polymer science. Part A, Polymer chemistry
  (literal)

Http://www.cnr.it/ontology/cnr/pubblicazioni.owl#autori

• E.Scamporrino, P.Mineo, A.Scamporrino, S.Dattilo, D.Vitalini, R.Alicata (literal)

Pagina inizio

• 5682 (literal)

Pagina fine

• 5689 (literal)

Http://www.cnr.it/ontology/cnr/pubblicazioni.owl#numeroVolume

• 47 (literal)

Rivista

• Journal of polymer science. Part A, Polymer chemistry (Rivista)

Http://www.cnr.it/ontology/cnr/pubblicazioni.owl#note

• ImpactFactor=3,529 (literal)

Http://www.cnr.it/ontology/cnr/pubblicazioni.owl#pagineTotali

• 8 (literal)

Note

• ISI Web of Science (WOS) (literal)

Http://www.cnr.it/ontology/cnr/pubblicazioni.owl#affiliazioni

• CNR, Università di Catania, Ufficio delle dogane di Trieste (literal)

Titolo

• Polyethersulfone-epoxy terminated materials as thermosetting resins for microelectronic devices (literal)

Abstract

• A totally arom. polyether/sulfone resin (PES-E) was synthesized and tested as an insulating glue in the construction of a Chip-on-Chip (CoC) device. PES-E, essentially constituted of open-chain macromols. of low mol. mass (Mn of about 3000 Da) with hydroxy and/or epoxy end-groups, has a glass transition temp. of about 150° and is subject to crosslinking at temps. higher than 320°. A CoC device was assembled using a five-step process by interposing a layer of PES-E between two chips. After curing, SEM cross section images showed a homogeneous crosslinked resin layer well stuck (flick and shear tests) to both chips. The chem. structure of the chains and the hydroxy/epoxy end-groups ratio were optimized to obtain a crosslinked material with good adhesion and sufficient flexibility to avoid cracking during assembly and use. (literal)

Prodotto di

• 4. Sistemi polimerici innovativi ad elevate prestazioni per applicazioni biomediche ed ambientali (PM.P02.009.001) (Modulo)
• Istituto di chimica e tecnologia dei polimeri (ICTP) (Istituto)

Autore CNR

• SANDRO DATTILO (Persona)
• DANIELE VITALINI (Unità di personale interno)
• EMILIO FRANCESCO SCAMPORRINO (Persona)

Insieme di parole chiave

• Keywords of "Polyethersulfone-epoxy terminated materials as thermosetting resins for microelectronic devices" (Insieme di parole chiave)

Incoming links:

Autore CNR di

• DANIELE VITALINI (Unità di personale interno)
• EMILIO FRANCESCO SCAMPORRINO (Persona)
• SANDRO DATTILO (Persona)

Prodotto

• Istituto di chimica e tecnologia dei polimeri (ICTP) (Istituto)
• 4. Sistemi polimerici innovativi ad elevate prestazioni per applicazioni biomediche ed ambientali (PM.P02.009.001) (Modulo)

Http://www.cnr.it/ontology/cnr/pubblicazioni.owl#rivistaDi

• Journal of polymer science. Part A, Polymer chemistry (Rivista)

Insieme di parole chiave di

• Keywords of "Polyethersulfone-epoxy terminated materials as thermosetting resins for microelectronic devices" (Insieme di parole chiave)