Polymeric mask protection for alternative KOH silicon wet etching (Articolo in rivista)

Type
Label
  • Polymeric mask protection for alternative KOH silicon wet etching (Articolo in rivista) (literal)
Anno
  • 2007-01-01T00:00:00+01:00 (literal)
Http://www.cnr.it/ontology/cnr/pubblicazioni.owl#doi
  • 10.1088/0960-1317/17/7/022 (literal)
Alternative label
  • Canavese G.; Marasso S.L.; Quaglio M.; Cocuzza M.; Ricciardi C.; Pirri C.F. (2007)
    Polymeric mask protection for alternative KOH silicon wet etching
    in Journal of micromechanics and microengineering (Print); IOP Publishing Ltd. (Institute of Physics Publishing Ltd), "Bristol ; London" (Regno Unito)
    (literal)
Http://www.cnr.it/ontology/cnr/pubblicazioni.owl#autori
  • Canavese G.; Marasso S.L.; Quaglio M.; Cocuzza M.; Ricciardi C.; Pirri C.F. (literal)
Pagina inizio
  • 1387 (literal)
Pagina fine
  • 1393 (literal)
Http://www.cnr.it/ontology/cnr/pubblicazioni.owl#numeroVolume
  • 17 (literal)
Rivista
Http://www.cnr.it/ontology/cnr/pubblicazioni.owl#numeroFascicolo
  • 7 (literal)
Note
  • ISI Web of Science (WOS) (literal)
  • Scopu (literal)
Http://www.cnr.it/ontology/cnr/pubblicazioni.owl#affiliazioni
  • LATEMAR Unit Politecnico di Torino, Materials and Microsystems Laboratory (X-Lab), Via Lungo Piazza D'Armi 6, 10034 Chivasso (Torino), Italy (literal)
Titolo
  • Polymeric mask protection for alternative KOH silicon wet etching (literal)
Abstract
  • A new cost-effective setup for silicon bulk micromachining is presented which makes use of a polymeric protective coating, ProTEKR ? B2 coating, instead of a conventional hardmask. Different concentrations of KOH and bath conditions (pure, with surfactant, with stirrer, with both surfactant and stirrer) have been considered. ProTEKR ? B2 coating exhibits good adhesion to Si substrates, no degradation, etching rates and surface roughness comparable to literature data, and etching times greater than 180 min without damaging front side microstructures. Microcantilevers have also been fabricated using two different process flows in order to demonstrate the suitability of such a protective coating in microelectromechanical system (MEMS) technology. (literal)
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