Evaluation of different PDMS interconnection solutions for silicon, Pyrex and COC microfluidic chips (Articolo in rivista)

Type

• Prodotto della ricerca (Classe)
• Articolo in rivista (Classe)

Label

• Evaluation of different PDMS interconnection solutions for silicon, Pyrex and COC microfluidic chips (Articolo in rivista) (literal)

Anno

• 2008-01-01T00:00:00+01:00 (literal)

Http://www.cnr.it/ontology/cnr/pubblicazioni.owl#doi

• 10.1088/0960-1317/18/5/055012 (literal)

Alternative label

• Quaglio M.; Canavese G.; Giuri E.; Marasso S.L.; Perrone D.; Cocuzza M.; Pirri C.F. (2008)
  Evaluation of different PDMS interconnection solutions for silicon, Pyrex and COC microfluidic chips
  in Journal of micromechanics and microengineering (Print); IOP Publishing Ltd. (Institute of Physics Publishing Ltd), "Bristol ; London" (Regno Unito)
  (literal)

Http://www.cnr.it/ontology/cnr/pubblicazioni.owl#autori

• Quaglio M.; Canavese G.; Giuri E.; Marasso S.L.; Perrone D.; Cocuzza M.; Pirri C.F. (literal)

Pagina inizio

• 55012-1 (literal)

Http://www.cnr.it/ontology/cnr/pubblicazioni.owl#numeroVolume

• 18 (literal)

Rivista

• Journal of micromechanics and microengineering (Rivista)

Http://www.cnr.it/ontology/cnr/pubblicazioni.owl#pagineTotali

• 10 (literal)

Http://www.cnr.it/ontology/cnr/pubblicazioni.owl#numeroFascicolo

• 5 (literal)

Note

• ISI Web of Science (WOS) (literal)
• Scopu (literal)

Http://www.cnr.it/ontology/cnr/pubblicazioni.owl#affiliazioni

• Materials and Microsystems Laboratory (Chi-Lab), Politecnico di Torino, LATEMAR Unit, Via Lungo Piazza D'Armi 6, 10034 Chivasso (Torino), Italy (literal)

Titolo

• Evaluation of different PDMS interconnection solutions for silicon, Pyrex and COC microfluidic chips (literal)

Abstract

• One of the most crucial issues in the domain of microfluidics is the chip to world interface. This paper describes a characterization methodology of a quite common microfluidic interconnection scheme, based on polydimethylsiloxane (PDMS), applied to some of the most popular substrates (silicon, Pyrex and cyclic olefin copolymer) for microfluidic applications. Particular emphasis is given to the evaluation of leakage endurance as a function of the main geometrical parameters of the interconnections and the selected bonding technique. Oxygen plasma activation of the PDMS surface and the application of a thin PDMS interlayer demonstrated the most attractive solutions, due to the straightforward approach and limited cost. Maximum sustainable pressures in excess of 200 kPa have been achieved. Results obtained are critically discussed with the aim to outline PDMS interconnection guidelines for different microfluidic applications. (literal)

Editore

• IOP Publishing Ltd. (Institute of Physics Publishing Ltd) (Editore)

Prodotto di

• Istituto dei materiali per l'elettronica ed il magnetismo (IMEM) (Istituto)

Autore CNR

• MATTEO COCUZZA (Unità di personale interno)

Insieme di parole chiave

• Keywords of "Evaluation of different PDMS interconnection solutions for silicon, Pyrex and COC microfluidic chips" (Insieme di parole chiave)

Incoming links:

Prodotto

• Istituto dei materiali per l'elettronica ed il magnetismo (IMEM) (Istituto)

Autore CNR di

• MATTEO COCUZZA (Unità di personale interno)

Http://www.cnr.it/ontology/cnr/pubblicazioni.owl#rivistaDi

• Journal of micromechanics and microengineering (Rivista)

Editore di

• IOP Publishing Ltd. (Institute of Physics Publishing Ltd) (Editore)

Insieme di parole chiave di

• Keywords of "Evaluation of different PDMS interconnection solutions for silicon, Pyrex and COC microfluidic chips" (Insieme di parole chiave)