http://www.cnr.it/ontology/cnr/individuo/prodotto/ID175993
Electrically Detected Magnetic Resonance of Donors and Interfacial Defects in Silicon Nanowires (Articolo in rivista)
- Type
- Label
- Electrically Detected Magnetic Resonance of Donors and Interfacial Defects in Silicon Nanowires (Articolo in rivista) (literal)
- Anno
- 2011-01-01T00:00:00+01:00 (literal)
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- M. Fanciulli1 2; A. Vellei 1, 2; C. Canevali 1; S. Baldovino 1; G. Pennelli 3; and M. Longo 2 (literal)
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- 1 Department of Material Science, Università degli Studi di Milano Bicocca, Via R. Cozzi 53 20125 Milano, Italy
2 CNR-IMM MDM Laboratory, Via C. Olivetti 2, 20864 Agrate Brianza (MB), Italy
3 Dipartimento di Ingegneria della Informazione: Elettronica, Informatica, Telecomunicazioni, Università di Pisa, Via G. Caruso, I-56122 Pisa, Italy (literal)
- Titolo
- Electrically Detected Magnetic Resonance of Donors and Interfacial Defects in Silicon Nanowires (literal)
- Abstract
- We report our work on the characterization by electrically detected magnetic resonance (EDMR)
measurements of silicon nanowires (SiNWs) produced by different top-down processes. SiNWs
were fabricated starting from SOI wafers using standard e-beam lithography and anisotropic wet
etching or by metal-assisted chemical etching. Further oxidation was used to reduce the wire cross
section. Different EDMR implementations were used to address the electronic wave function of
donors (P) and to characterize point defects at the SiNWs/SiO2 interface. The EDMR spectra of as
produced SiNWs with high donor concentration ([P] = 1018 cm-3 show a single line related to delocalized
electrons. SiNWs produced on substrates with lower donor concentration ([P] < 1016 cm-3
reveal the doublet related to substitutional P in Si, as well as lines related to interfacial defects such
as Pb0, Pb, E', and E'-like. The EDMR spectra of samples produced by metal-assisted chemical
etching exposed to post production oxidation reveal a disordered and defective interface and the
disappearance of the P related signal. Forming gas annealing, on the other hand, reduces the
contribution of interfacial defects and allows a better resolution of the P related doublet. (literal)
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