http://www.cnr.it/ontology/cnr/individuo/prodotto/ID172214
Alternative Materials for RF MEMS Switches in III-V Technology (Contributo in atti di convegno)
- Type
- Label
- Alternative Materials for RF MEMS Switches in III-V Technology (Contributo in atti di convegno) (literal)
- Anno
- 2010-01-01T00:00:00+01:00 (literal)
- Alternative label
Persano A, Quaranta F, Cola A, Martucci MC, Cretì P, Taurino A, Siciliano P, Marcelli R, De Angelis G, Lucibello A (2010)
Alternative Materials for RF MEMS Switches in III-V Technology
in Symposium on Design, Test, Integration and Packaging of MEMS/MOEMS, DTIP 2010, Siviglia, May 5-7, 2010
(literal)
- Http://www.cnr.it/ontology/cnr/pubblicazioni.owl#autori
- Persano A, Quaranta F, Cola A, Martucci MC, Cretì P, Taurino A, Siciliano P, Marcelli R, De Angelis G, Lucibello A (literal)
- Pagina inizio
- Pagina fine
- Http://www.cnr.it/ontology/cnr/pubblicazioni.owl#titoloVolume
- Proceedings of Symposium on Design, Test, Integration and Packaging of MEMS/MOEMS, DTIP 2010 (literal)
- Http://www.cnr.it/ontology/cnr/pubblicazioni.owl#affiliazioni
- IMM-CNR, Institute for Microelectronics and Microsystems, Unit of Lecce; IMM-CNR, Institute for Microelectronics and Microsystems, Unit of Roma (literal)
- Titolo
- Alternative Materials for RF MEMS Switches in III-V Technology (literal)
- Http://www.cnr.it/ontology/cnr/pubblicazioni.owl#isbn
- 978-2-35500-011-9 (literal)
- Abstract
- In this work we develop surface-micromachined
RF MEMS switches in III-V technology making use of
materials which can be alternative to the ones commonly used.
In this way, some technological constraints concerning RF
MEMS reliability can be overcome. Specifically, we evaluate
the potential of tantalum nitride (TaN) and tantalum
pentoxide (Ta2O5) to be used for the switches actuation pads
and dielectric layers, respectively. To this scope, a
compositional, structural and electrical characterization of
TaN and Ta2O5 films as a function of the deposition
parameters (temperature, sputtering mixture composition, and
film thickness) is performed. Both shunt and series switches
are prepared and show good switching capabilities by a
preliminary analysis. The complete device characterization is
in progress and will be presented. (literal)
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