Techniques for mechanical strain analysis in sub-micrometer structures: TEM/CBED, micro-Raman spectroscopy, X-ray microdiffraction and modeling (Articolo in rivista)

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Label
  • Techniques for mechanical strain analysis in sub-micrometer structures: TEM/CBED, micro-Raman spectroscopy, X-ray microdiffraction and modeling (Articolo in rivista) (literal)
Anno
  • 2003-01-01T00:00:00+01:00 (literal)
Http://www.cnr.it/ontology/cnr/pubblicazioni.owl#doi
  • 10.1016/S0167-9317(03)00372-1 (literal)
Alternative label
  • De Wolf I.; Senez V.; Balboni R.; Armigliato A.; Frabboni S.; Cedola A.; Lagomarsino S. (2003)
    Techniques for mechanical strain analysis in sub-micrometer structures: TEM/CBED, micro-Raman spectroscopy, X-ray microdiffraction and modeling
    in Microelectronic engineering; ELSEVIER SCIENCE BV, PO BOX 211, 1000 AE AMSTERDAM, NETHERLANDS, AMSTERDAM (Paesi Bassi)
    (literal)
Http://www.cnr.it/ontology/cnr/pubblicazioni.owl#autori
  • De Wolf I.; Senez V.; Balboni R.; Armigliato A.; Frabboni S.; Cedola A.; Lagomarsino S. (literal)
Pagina inizio
  • 425 (literal)
Pagina fine
  • 435 (literal)
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  • 70 (literal)
Rivista
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  • 11 (literal)
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  • 2-4 (literal)
Note
  • ISI Web of Science (WOS) (literal)
Http://www.cnr.it/ontology/cnr/pubblicazioni.owl#affiliazioni
  • IMEC VZW, B-3001 Louvain, Belgium IEMN, ISEN, CNRS, UMR 8520, F-59652 Villeneuve Dascq, France CNR, IMM, Sez Bologna, I-40129 Bologna, Italy Univ Modena & Reggio Emilia, Dipartimento Fis, I-41100 Modena, Italy CNR, IFN, I-00156 Rome, Italy (literal)
Titolo
  • Techniques for mechanical strain analysis in sub-micrometer structures: TEM/CBED, micro-Raman spectroscopy, X-ray microdiffraction and modeling (literal)
Abstract
  • In this paper, three techniques are discussed that provide information on process-induced local mechanical stress in silicon: the convergent beam electron diffraction technique of transmission electron microscopy, X-ray micro-diffraction and micro-Raman spectroscopy. We discuss the principles of these techniques, their spatial resolution, the ease-of-use, the information that can be obtained, the required sample preparation, the measurement time, and the complementarities of these techniques. We demonstrate this for stress induced by shallow trench isolation and correlate the results to finite element analysis results. (literal)
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