Material Properties Measurement and Numerical Simulation for Characterization of Ultra-Low-Power Consumption Hotplates (Contributo in atti di convegno)

Type
Label
  • Material Properties Measurement and Numerical Simulation for Characterization of Ultra-Low-Power Consumption Hotplates (Contributo in atti di convegno) (literal)
Anno
  • 2007-01-01T00:00:00+01:00 (literal)
Http://www.cnr.it/ontology/cnr/pubblicazioni.owl#doi
  • 10.1109/SENSOR.2007.4300469 (literal)
Alternative label
  • Cozzani E, Roncaglia A, Zampolli S, Elmi I, Mancarella F, Tamarri F, Cardinali GC (2007)
    Material Properties Measurement and Numerical Simulation for Characterization of Ultra-Low-Power Consumption Hotplates
    in International Solid-State Sensors, Actuators and Microsystems Conference, 2007 (TRANSDUCERS 2007 and EUROSENSORSXXI), Lyon (France), 10-14 June 2007
    (literal)
Http://www.cnr.it/ontology/cnr/pubblicazioni.owl#autori
  • Cozzani E, Roncaglia A, Zampolli S, Elmi I, Mancarella F, Tamarri F, Cardinali GC (literal)
Pagina inizio
  • 1661 (literal)
Pagina fine
  • 1664 (literal)
Http://www.cnr.it/ontology/cnr/pubblicazioni.owl#url
  • http://ieeexplore.ieee.org/xpl/articleDetails.jsp?tp=&arnumber=4300469&contentType=Conference+Publications&queryText%3DMaterial+Properties+Measurement+and+Numerical+Simulation+for+Characterization+of+Ultra-Low-Power+Consumption+Hotplates (literal)
Http://www.cnr.it/ontology/cnr/pubblicazioni.owl#titoloVolume
  • Solid-State Sensors, Actuators and Microsystems Conference, 2007. TRANSDUCERS 2007. International (literal)
Rivista
Http://www.cnr.it/ontology/cnr/pubblicazioni.owl#pagineTotali
  • 4 (literal)
Http://www.cnr.it/ontology/cnr/pubblicazioni.owl#affiliazioni
  • CNR IMM Bologna (literal)
Titolo
  • Material Properties Measurement and Numerical Simulation for Characterization of Ultra-Low-Power Consumption Hotplates (literal)
Http://www.cnr.it/ontology/cnr/pubblicazioni.owl#isbn
  • 1-4244-0842-3 (literal)
Abstract
  • The results of a thorough thermoelectric characterization, performed both in a vacuum chamber and at atmospheric pressure, of ultra-low-power hotplates based on suspended structures with different layouts are presented in this work and compared with thermoelectric 2D and thermal 3D finite elements simulations. Electrical and thermal properties of the thin films used in the devices have been also measured, involving appropriate on-chip test structures, and their values were employed in both 2D and 3D model. Temperature vs. heating power experimental curves showed the great influence of conduction through air on power consumption and an excellent agreement with the simulated results. (literal)
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